Inventor · disambiguated record
Marcel Wall
Also filed as: WALL MARCEL · WALL MARCEL A · WALL MARCEL ARLAN
13 granted patents·36 pending applications·4 citations·filing 2015–2024
82Inventor score
Top patents by PatentIndex Score
49 records- 0178US10658281B2Integrated circuit substrate and method of makingINTEL CORP·Filed 2017·Granted May 19, 2020·2 cites·5 claims
- 0273US11177232B2Circuit device with monolayer bonding between surface structuresINTEL CORP·Filed 2018·Granted Nov 16, 2021·2 cites·19 claims
- 0361US12057252B2Electronic substrates having embedded inductorsINTEL CORP·Filed 2020·Granted Aug 6, 2024·0 cites·11 claims
- 0459US12349282B2Capacitors in through glass viasINTEL CORP·Filed 2021·Granted Jul 1, 2025·0 cites·23 claims
- 0558US2025210506A1Passivation boundary defects for reduced leakage current capacitor dielectric materialsINTEL CORP·Filed 2023·Application pending·0 cites
- 0657US2025279346A1High aspect ratio vias with low stress in integrated circuit packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 0757US2020211952A1Integrated circuit substrate and method of makingINTEL CORP·Filed 2020·Application pending·0 cites
- 0856US2025006781A1Carbon nanofiber capacitor apparatus and related methodsINTEL CORP·Filed 2023·Application pending·0 cites
- 0956US2025006671A1Semiconductor layer with dry deposition layerINTEL CORP·Filed 2023·Application pending·0 cites
- 1055US12159825B2Dielectric-to-metal adhesion promotion materialINTEL CORP·Filed 2021·Granted Dec 3, 2024·0 cites·20 claims
- 1155US2025006646A1Through glass vias with compliant layer for integrated circuit device packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 1254US2024186264A1Polymer layers for adhesive promotion and stress management in glass layers in integrated circuit devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 1354US2024213132A1Thin film capacitors (tfcs) in etched back deep viaINTEL CORP·Filed 2022·Application pending·0 cites
- 1454US2024213131A1Direct plating of copper on dielectrics for glass core platingINTEL CORP·Filed 2022·Application pending·0 cites
- 1554US2024321657A1Photonic integrated circuit packages and methods of manufacturing the sameINTEL CORP·Filed 2023·Application pending·0 cites
- 1653US2025006616A1Hybrid metallization surfaces for integrated circuit packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 1753US2025014954A1Hybrid cores including adhesive promotion layers and related methodsAGARWAL SOHAM·Filed 2024·Application pending·0 cites
- 1852US2024332100A1Glass-integrated inductors in integrated circuit packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 1952US2024006380A1Metallization surface treatment for integrated circuit packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 2052US2024006283A1Edge delamination and crack prevention methods for sinx and ti-cu enabled packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 2152US2024006297A1Silicide and silicon nitride layers between a dielectric and copperINTEL CORP·Filed 2022·Application pending·0 cites
- 2252US2024222018A1Substrate package-integrated oxide capacitors and related methodsINTEL CORP·Filed 2022·Application pending·0 cites
- 2351US12476175B2Glass substrates having transverse capacitors for use with semiconductor packages and related methodsINTEL CORP·Filed 2021·Granted Nov 18, 2025·0 cites·17 claims
- 2451US2023420322A1Organic adhesion promotor for dielectric adhesion to a copper traceINTEL CORP·Filed 2022·Application pending·0 cites
- 2551US2024213301A1Thin film capacitor (tfc) architectures for package substratesINTEL CORP·Filed 2022·Application pending·0 cites
- 2651US2025006614A1Intervening layers for thru-via seed metallizationSHANMUGAM RENGARAJAN·Filed 2023·Application pending·0 cites
- 2751US2023402368A1Technologies for thin film resistors in viasINTEL CORP·Filed 2022·Application pending·0 cites
- 2850US11177234B2Package architecture with improved via drill process and method for forming such packageINTEL CORP·Filed 2018·Granted Nov 16, 2021·0 cites·25 claims
- 2950US2024006300A1Substrates having adhesion promotor layers and related methodsINTEL CORP·Filed 2022·Application pending·0 cites
- 3050US2024006299A1Sinx based surface finish architectureINTEL CORP·Filed 2022·Application pending·0 cites
- 3150US2023317583A1Modification of sinx thin film for improved adhesion of metal-dielectrics for hsio packagingINTEL CORP·Filed 2022·Application pending·0 cites
- 3250US2023317584A1Plasma-induced surface functionalization of sinx thin film for improved adhesion of metal-dielectric for hsioINTEL CORP·Filed 2022·Application pending·0 cites
- 3350US2024006291A1Pocketed copper in first layer interconnect and methodINTEL CORP·Filed 2022·Application pending·0 cites
- 3449US11445616B2Interfacial layer for high resolution lithography (HRL) and high speed input/output (IO or I/O) architecturesINTEL CORP·Filed 2018·Granted Sep 13, 2022·0 cites·12 claims
- 3549US2024188222A1Method of forming a package substrateINTEL CORP·Filed 2022·Application pending·0 cites
- 3649US2024006298A1Substrate having one or more electrical interconnectsINTEL CORP·Filed 2022·Application pending·0 cites
- 3748US12033930B2Selectively roughened copper architectures for low insertion loss conductive featuresINTEL CORP·Filed 2020·Granted Jul 9, 2024·0 cites·18 claims
- 3848US2023085997A1Methods and apparatus to improve adhesion between metals and dielectrics in circuit devicesINTEL CORP·Filed 2021·Application pending·0 cites
- 3947US12416093B2Electroless plating processINTEL CORP·Filed 2021·Granted Sep 16, 2025·0 cites·13 claims
- 4046US11694898B2Hybrid fine line spacing architecture for bump pitch scalingINTEL CORP·Filed 2019·Granted Jul 4, 2023·0 cites·19 claims
- 4145US2023107096A1Through glass via with a metal wallINTEL CORP·Filed 2021·Application pending·0 cites
- 4244US2023082385A1Defect-free through glass via metallization implementing a reverse filling architectureECTON JEREMY D·Filed 2021·Application pending·0 cites
- 4343US11501967B2Selective metal deposition by patterning direct electroless metal platingINTEL CORP·Filed 2019·Granted Nov 15, 2022·0 cites·12 claims
- 4441US11291122B2Apparatus with a substrate provided with plasma treatmentINTEL CORP·Filed 2017·Granted Mar 29, 2022·0 cites·14 claims
- 4541US2020312768A1Controlled organic layers to enhance adhesion to organic dielectrics and process for forming suchINTEL CORP·Filed 2019·Application pending·0 cites
- 4639US2021090946A1Multiple layer copper seedingINTEL CORP·Filed 2019·Application pending·0 cites
- 4736US2020315023A1Copper interface features for high speed interconnect applicationsINTEL CORP·Filed 2019·Application pending·0 cites
- 4832US2017170080A1Material thickness device and methodINTEL CORP·Filed 2015·Application pending·0 cites
- 4932US2017176173A1Measuring surface layer thicknessINTEL CORP·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Marcel Wall files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →