Inventor · disambiguated record
Matthew B. Wasserman
Also filed as: WASSERMAN MATTHEW B
22 granted patents·2 pending applications·43 citations·filing 2014–2024
93Inventor score
Files withKULICKE & SOFFA IND INC24
Top patents by PatentIndex Score
24 records- 0191US9576928B2Bond head assemblies, thermocompression bonding systems and methods of assembling and operating the sameKULICKE & SOFFA IND INC·Filed 2016·Granted Feb 21, 2017·7 cites·26 claims
- 0288US9093549B2Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the sameKULICKE & SOFFA IND INC·Filed 2014·Granted Jul 28, 2015·8 cites·30 claims
- 0386US9425162B2Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the sameKULICKE & SOFFA IND INC·Filed 2015·Granted Aug 23, 2016·5 cites·14 claims
- 0483US9478516B2Methods of operating bonding machines for bonding semiconductor elements, and bonding machinesKULICKE & SOFFA IND INC·Filed 2015·Granted Oct 25, 2016·4 cites·15 claims
- 0581US9136243B2Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elementsKULICKE & SOFFA IND INC·Filed 2014·Granted Sep 15, 2015·6 cites·21 claims
- 0680US10468373B2Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machinesKULICKE & SOFFA IND INC·Filed 2018·Granted Nov 5, 2019·4 cites·14 claims
- 0778US12381175B2Bonding systems, and methods of providing a reducing gas on a bonding systemKULICKE & SOFFA IND INC·Filed 2024·Granted Aug 5, 2025·0 cites·20 claims
- 0872US12062636B2Bonding systems, and methods of providing a reducing gas on a bonding systemKULICKE & SOFFA IND INC·Filed 2023·Granted Aug 13, 2024·0 cites·22 claims
- 0972US2024266318A1Bonding systems for bonding a semiconductor element to a substrate, and related methodsKULICKE & SOFFA IND INC·Filed 2024·Application pending·0 cites
- 1071US9425163B2Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elementsKULICKE & SOFFA IND INC·Filed 2015·Granted Aug 23, 2016·2 cites·24 claims
- 1170US9997383B2Bond head assemblies, thermocompression bonding systems and methods of assembling and operating the sameKULICKE & SOFFA IND INC·Filed 2017·Granted Jun 12, 2018·1 cites·26 claims
- 1270US9165902B2Methods of operating bonding machines for bonding semiconductor elements, and bonding machinesKULICKE & SOFFA IND INC·Filed 2014·Granted Oct 20, 2015·2 cites·11 claims
- 1368US9780066B2Thermocompression bonding systems and methods of operating the sameKULICKE & SOFFA IND INC·Filed 2017·Granted Oct 3, 2017·1 cites·15 claims
- 1468US2024063169A1Bonding systems for bonding a semiconductor element to a substrate, and related methodsKULICKE & SOFFA IND INC·Filed 2023·Application pending·0 cites
- 1567US9847314B2Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the sameKULICKE & SOFFA IND INC·Filed 2016·Granted Dec 19, 2017·1 cites·22 claims
- 1665US9929121B2Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machinesKULICKE & SOFFA IND INC·Filed 2016·Granted Mar 27, 2018·1 cites·34 claims
- 1763US9659902B2Thermocompression bonding systems and methods of operating the sameKULICKE & SOFFA IND INC·Filed 2015·Granted May 23, 2017·1 cites·14 claims
- 1862US12500204B2Bonding systems for bonding of semiconductor elements to substrates including a gas composition analyzer, and related methodsKULICKE & SOFFA IND INC·Filed 2022·Granted Dec 16, 2025·0 cites·21 claims
- 1962US12431459B2Methods of monitoring gas byproducts of a bonding system, and related monitoring systems and bonding systemsKULICKE & SOFFA IND INC·Filed 2023·Granted Sep 30, 2025·0 cites·26 claims
- 2061US11342301B2Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methodsKULICKE & SOFFA IND INC·Filed 2021·Granted May 24, 2022·0 cites·20 claims
- 2151US11049839B2Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methodsKULICKE & SOFFA IND INC·Filed 2019·Granted Jun 29, 2021·0 cites·17 claims
- 2246US11031367B2Bond head assemblies including reflective optical elements, related bonding machines, and related methodsKULICKE & SOFFA IND INC·Filed 2017·Granted Jun 8, 2021·0 cites·20 claims
- 2342US11011493B2Bonding and placement tools for bonding machines, bonding machines for bonding semiconductor elements, and related methodsKULICKE & SOFFA IND INC·Filed 2018·Granted May 18, 2021·0 cites·20 claims
- 2441US9731378B2Thermocompression bonders, methods of operating thermocompression bonders, and horizontal correction motions using lateral force measurement in thermocompression bondingKULICKE & SOFFA IND INC·Filed 2016·Granted Aug 15, 2017·0 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →