Inventor · disambiguated record
Matthias Wietstruck
Also filed as: WIETSTRUCK MATTHIAS
1 granted patent·2 pending applications·1 citations·filing 2017–2024
15Inventor score
Files withIHP GMBH INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS / LEIBNIZ INST FUR INNOVATIVE MIKRO1IHP GMBH INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/LEIBNIZ INST FUER INNOVATIVE MIKROELEKT1IHP GMBH—INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/LEIBNIZ INST FUR INNOVATIVE MIKROE1
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3 records- 0158US10832953B2Technological method for preventing, by means of buried etch stop layers, the creation of vertical/lateral inhomogeneities when etching through-silicon viasIHP GMBH—INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/LEIBNIZ INST FUR INNOVATIVE MIKROE·Filed 2017·Granted Nov 10, 2020·1 cites·12 claims
- 0245US2025022839A1Method and system of performing collective die-to-wafer bondingIHP GMBH INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/LEIBNIZ INST FUER INNOVATIVE MIKROELEKT·Filed 2024·Application pending·0 cites
- 0336US2023187301A1Fan-out wafer-level packageIHP GMBH INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS / LEIBNIZ INST FUR INNOVATIVE MIKRO·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →