Inventor · disambiguated record
Maciej Wojnowski
Also filed as: WOJNOWSKI MACIEJ
40 granted patents·5 pending applications·388 citations·filing 2009–2025
97Inventor score
Files withINFINEON TECHNOLOGIES AG37INFINEON TECHNOLOGIES AUSTRIA AG4BEER GOTTFRIED1BOECK JOSEF1GEITNER OTTMAR1
Top patents by PatentIndex Score
45 records- 0198US8952521B2Semiconductor packages with integrated antenna and method of forming thereofINFINEON TECHNOLOGIES AG·Filed 2013·Granted Feb 10, 2015·90 cites·28 claims
- 0297US9583811B2Transition between a plastic waveguide and a semiconductor chip, where the semiconductor chip is embedded and encapsulated within a mold compoundINFINEON TECHNOLOGIES AG·Filed 2014·Granted Feb 28, 2017·41 cites·22 claims
- 0396US8866292B2Semiconductor packages with integrated antenna and methods of forming thereofBEER GOTTFRIED·Filed 2013·Granted Oct 21, 2014·65 cites·25 claims
- 0496US8451618B2Integrated antennas in wafer level packageBOECK JOSEF·Filed 2010·Granted May 28, 2013·43 cites·12 claims
- 0596US8278749B2Integrated antennas in wafer level packageLACHNER RUDOLF·Filed 2009·Granted Oct 2, 2012·46 cites·14 claims
- 0695US8460967B2Integrated antennas in wafer level packageINFINEON TECHNOLOGIES AG·Filed 2012·Granted Jun 11, 2013·15 cites·7 claims
- 0794US11824019B2Chip package with substrate integrated waveguide and waveguide interfaceINFINEON TECHNOLOGIES AG·Filed 2021·Granted Nov 21, 2023·4 cites·24 claims
- 0893US11872853B2Selective activation of tire pressure monitoring system (TPMS) sensor modules for radio-frequency (RF) communication using directional RF beamsINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 16, 2024·2 cites·26 claims
- 0992US10121751B2Integrated antennas in wafer level packageINFINEON TECHNOLOGIES AG·Filed 2016·Granted Nov 6, 2018·6 cites·13 claims
- 1090US9349696B2Integrated antennas in wafer level packageINFINEON TECHNOLOGIES AG·Filed 2014·Granted May 24, 2016·7 cites·8 claims
- 1190US8669655B2Chip package and a method for manufacturing a chip packageGEITNER OTTMAR·Filed 2012·Granted Mar 11, 2014·26 cites·24 claims
- 1289US11195787B2Semiconductor device including an antennaINFINEON TECHNOLOGIES AG·Filed 2016·Granted Dec 7, 2021·7 cites·12 claims
- 1388US10692824B2Radar module with wafer level package and underfillINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jun 23, 2020·3 cites·11 claims
- 1488US9910145B2Wireless communication system, a radar system and a method for determining a position information of an objectINFINEON TECHNOLOGIES AG·Filed 2013·Granted Mar 6, 2018·7 cites·19 claims
- 1588US8624381B2Integrated antennas in wafer level packageINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jan 7, 2014·6 cites·13 claims
- 1684US12040543B2Radio-frequency devices and methods for producing radio-frequency devicesINFINEON TECHNOLOGIES AG·Filed 2022·Granted Jul 16, 2024·1 cites·20 claims
- 1783US9064787B2Integrated antennas in wafer level packageINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jun 23, 2015·5 cites·18 claims
- 1882US10217695B2Connector block with two sorts of through connections, and electronic device comprising a connector blockINFINEON TECHNOLOGIES AG·Filed 2016·Granted Feb 26, 2019·3 cites·13 claims
- 1979US11996771B2Power semiconductor system having an inductor module attached to a power stage moduleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted May 28, 2024·0 cites·14 claims
- 2079US11658135B2Semiconductor devices comprising a radar semiconductor chip and associated production methodsINFINEON TECHNOLOGIES AG·Filed 2020·Granted May 23, 2023·1 cites·20 claims
- 2176US10186481B2Semiconductor device including a passive component formed in a redistribution layerINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jan 22, 2019·1 cites·21 claims
- 2275US12014998B2Semiconductor devices comprising a radar semiconductor chip and associated production methodsINFINEON TECHNOLOGIES AG·Filed 2023·Granted Jun 18, 2024·0 cites·20 claims
- 2372US11539291B2Method of manufacturing a power semiconductor systemINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Dec 27, 2022·0 cites·6 claims
- 2470US10833583B2Methods of manufacturing inductor modules and power semiconductor systems having inductor modulesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Nov 10, 2020·0 cites·18 claims
- 2570US9577852B2Common-mode suppressor based on differential transmission lineINFINEON TECHNOLOGIES AG·Filed 2014·Granted Feb 21, 2017·3 cites·18 claims
- 2669US11879966B2Transmission of wireless signal having information on a local oscillator signalINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 23, 2024·0 cites·25 claims
- 2768US11355838B2Integration of EBG structures (single layer/multi-layer) for isolation enhancement in multilayer embedded packaging technology at mmWaveINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jun 7, 2022·2 cites·22 claims
- 2868US9337522B2Millimeter-wave system including a waveguide transition connected to a transmission line and surrounded by a plurality of viasINFINEON TECHNOLOGIES AG·Filed 2013·Granted May 10, 2016·2 cites·25 claims
- 2966US9337159B2Semiconductor package with integrated microwave componentINFINEON TECHNOLOGIES AG·Filed 2013·Granted May 10, 2016·1 cites·12 claims
- 3063US2022148951A1Semiconductor device including an antennaINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
- 3163US2023314345A1Gas sensor devices, methods for producing same, and methods for generating absorption spectra of gasesINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 3262US9230926B2Functionalised redistribution layerINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jan 5, 2016·1 cites·20 claims
- 3360US12094842B2Semiconductor device having an antenna arranged over an active main surface of a semiconductor dieINFINEON TECHNOLOGIES AG·Filed 2019·Granted Sep 17, 2024·0 cites·10 claims
- 3458US10601314B2Power semiconductor systems having inductor modules, and methods of manufacturing inductor modules and power semiconductor systems having inductor modulesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2017·Granted Mar 24, 2020·0 cites·13 claims
- 3556US9922946B2Method of manufacturing a semiconductor package having a semiconductor chip and a microwave componentINFINEON TECHNOLOGIES AG·Filed 2017·Granted Mar 20, 2018·0 cites·20 claims
- 3654US9653426B2Method of manufacturing a semiconductor package having an integrated microwave componentINFINEON TECHNOLOGIES AG·Filed 2016·Granted May 16, 2017·0 cites·7 claims
- 3753US2018180730A1Transmission of wireless signal having information on a local oscillator signalINFINEON TECHNOLOGIES AG·Filed 2018·Application pending·0 cites
- 3851US11251146B2Semiconductor devices having a non-galvanic connectionINFINEON TECHNOLOGIES AG·Filed 2020·Granted Feb 15, 2022·0 cites·20 claims
- 3951US2017309582A1Semiconductor Devices with On-Chip Antennas and Manufacturing ThereofINFINEON TECHNOLOGIES AG·Filed 2017·Application pending·0 cites
- 4050US10930541B2Method of forming a chip arrangement, chip arrangement, method of forming a chip package, and chip packageINFINEON TECHNOLOGIES AG·Filed 2019·Granted Feb 23, 2021·0 cites·32 claims
- 4148US11145563B2Semiconductor devices having cutouts in an encapsulation material and associated production methodsINFINEON TECHNOLOGIES AG·Filed 2019·Granted Oct 12, 2021·0 cites·25 claims
- 4247US2025357390A1Radio frequency semiconductor device and method for fabricating a radio frequency semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 4346US11387533B2Semiconductor package with plastic waveguideINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jul 12, 2022·0 cites·24 claims
- 4445US9356332B2Integrated-circuit module with waveguide transition elementINFINEON TECHNOLOGIES AG·Filed 2013·Granted May 31, 2016·0 cites·18 claims
- 4541US10916484B2Electronic device including redistribution layer pad having a voidINFINEON TECHNOLOGIES AG·Filed 2018·Granted Feb 9, 2021·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →