Inventor · disambiguated record
Mayue Xie
Also filed as: XIE MAYUE
15 granted patents·1 pending application·90 citations·filing 2005–2018
91Inventor score
Top patents by PatentIndex Score
16 records- 0194US10935593B2Method of resonance analysis for electrical fault isolationINTEL CORP·Filed 2017·Granted Mar 2, 2021·21 cites·26 claims
- 0292US9159646B2Apparatus and method to monitor die edge defectsINTEL CORP·Filed 2012·Granted Oct 13, 2015·12 cites·16 claims
- 0387US8356402B2Connector compression toolMEZZALINGUA JOHN ASS·Filed 2010·Granted Jan 22, 2013·10 cites·18 claims
- 0486US8112877B2Connector compression toolXIE MAYUE·Filed 2010·Granted Feb 14, 2012·8 cites·7 claims
- 0584US11450613B2Integrated circuit package with test circuitry for testing a channel between diesINTEL CORP·Filed 2018·Granted Sep 20, 2022·4 cites·15 claims
- 0684US8112876B2Method of compressing a connectorXIE MAYUE·Filed 2010·Granted Feb 14, 2012·7 cites·9 claims
- 0783US7823271B2Connector compression toolMEZZALINGUA JOHN ASS·Filed 2005·Granted Nov 2, 2010·18 cites·11 claims
- 0879US9564381B2Apparatus and method to monitor die edge defectsINTEL CORP·Filed 2015·Granted Feb 7, 2017·2 cites·20 claims
- 0971US7607218B2Tool adaptorMEZZALINGUA JOHN ASS·Filed 2005·Granted Oct 27, 2009·6 cites·20 claims
- 1064US9817028B2Terahertz transmission contactless probing and scanning for signal analysis and fault isolationINTEL CORP·Filed 2015·Granted Nov 14, 2017·1 cites·25 claims
- 1161US10908206B2Characterization of transmission mediaINTEL CORP·Filed 2016·Granted Feb 2, 2021·1 cites·25 claims
- 1257US10026664B2Apparatus and method to monitor die edge defectsINTEL CORP·Filed 2017·Granted Jul 17, 2018·0 cites·19 claims
- 1349US10088518B1Apparatus and method for classifying and locating electrical faults in circuitryINTEL CORP·Filed 2017·Granted Oct 2, 2018·0 cites·20 claims
- 1443US10746780B2High power terahertz impulse for fault isolationINTEL CORP·Filed 2015·Granted Aug 18, 2020·0 cites·23 claims
- 1537US2016274044A1Circuit device inspection systems using temperature gradientsINTEL CORP·Filed 2015·Application pending·0 cites
- 1632US11226353B2Integrated cable probe design for high bandwidth RF testingINTEL CORP·Filed 2017·Granted Jan 18, 2022·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →