Inventor · disambiguated record
Makoto Yamagata
Also filed as: YAMAGATA MAKOTO
1 granted patent·5 pending applications·0 citations·filing 2006–2018
8Inventor score
Top patents by PatentIndex Score
6 records- 0148US11499776B2Method for constructing natural gas liquefaction plantCHIYODA CORP·Filed 2018·Granted Nov 15, 2022·0 cites·7 claims
- 0248US2009317591A1Metal Composite Laminate for Producing Flexible Wiring Board and Flexible Wiring BoardMITSUI MINING & SMELTING CO·Filed 2007·Application pending·0 cites
- 0337US2008174016A1Flexible Printed Wiring Board and Semiconductor DeviceMITSUI MINING & SMELTING CO·Filed 2007·Application pending·0 cites
- 0435US2008006441A1Wiring board and semiconductor device excellent in folding enduranceMITSUI MINING & SMELTING CO·Filed 2007·Application pending·0 cites
- 0534US2007098910A1Flexible copper clad laminate, flexible printed wiring board obtained by using flexible copper clad laminate thereof, film carrier tape obtained by using flexible copper clad laminate thereof, semiconductor device obtained by using flexible copper clad laminate thereof, method of manufacturing flexible copper clad laminate and method of manufacturing film carrier tapeMITSUI MINING & SMELTING CO·Filed 2006·Application pending·0 cites
- 0634US2007090086A1Two-layer flexible printed wiring board and method for manufacturing the two-layer flexible printed wiring boardMITSUI MINING & SMELTING CO·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →