Inventor · disambiguated record
Masaharu Yamamoto
Also filed as: YAMAMOTO MASAHARU
26 granted patents·7 pending applications·373 citations·filing 1988–2025
96Inventor score
Files withHITACHI METALS LTD4NEOMAX MATERIALS CO LTD4MATSUSHITA ELECTRONICS CORP3NEOMAX MAT CO LTD2ODA YOSHIMITSU2
Top patents by PatentIndex Score
33 records- 0195US4987030AHigh-tenacity conjugated fiber and process for preparation thereofTORAY INDUSTRIES·Filed 1988·Granted Jan 22, 1991·158 cites·4 claims
- 0284US5123961ASolid inkBROTHER IND LTD·Filed 1991·Granted Jun 23, 1992·47 cites·5 claims
- 0382US10193126B2Battery terminal, method for manufacturing battery terminal, and batteryNEOMAX MAT CO LTD·Filed 2015·Granted Jan 29, 2019·2 cites·20 claims
- 0480US7790988B2Hermetic sealing cap, electronic component accommodation package, and method for producing hermetic sealing capNEOMAX MATERIALS CO LTD·Filed 2007·Granted Sep 7, 2010·9 cites·16 claims
- 0576US5239197ANon-volatile memory device and transistor circuits on the same chipMATSUSHITA ELECTRONICS CORP·Filed 1992·Granted Aug 24, 1993·35 cites·5 claims
- 0675US10696589B2Glass bonding material and multilayer glassHITACHI METALS LTD·Filed 2017·Granted Jun 30, 2020·1 cites·18 claims
- 0772US8785029B2Connection plate for battery terminals and method for manufacturing connection plate for battery terminalsODA YOSHIMITSU·Filed 2011·Granted Jul 22, 2014·3 cites·20 claims
- 0872US5633042AProcess for manufacturing prepregs for use as electric insulating materialMATSUSHITA ELECTRIC WORKS LTD·Filed 1996·Granted May 27, 1997·34 cites·14 claims
- 0968US6441397B2Evaluation of semiconductor chargeup damage and apparatus thereforMATSUSHITA ELECTRONICS CORP·Filed 2001·Granted Aug 27, 2002·11 cites·16 claims
- 1067US8431820B2Hermetic sealing capYAMAMOTO MASAHARU·Filed 2009·Granted Apr 30, 2013·7 cites·15 claims
- 1163US10595424B2Hermetic sealing lid memberHITACHI METALS LTD·Filed 2015·Granted Mar 17, 2020·0 cites·13 claims
- 1263US9525228B2Battery terminal, method for manufacturing battery terminal, and batteryNEOMAX MAT CO LTD·Filed 2014·Granted Dec 20, 2016·4 cites·19 claims
- 1361US2024362477A1Information processing device, information processing method, and computer program productTOSHIBA KK·Filed 2024·Application pending·0 cites
- 1458US2025224717A1Information processing apparatus and information processing methodTOSHIBA KK·Filed 2025·Application pending·0 cites
- 1556US11178786B2Method for manufacturing hermetic sealing lid memberHITACHI METALS LTD·Filed 2019·Granted Nov 16, 2021·0 cites·5 claims
- 1651US7173331B2Hermetic sealing cap and method of manufacturing the sameNEOMAX MATERIALS CO LTD·Filed 2004·Granted Feb 6, 2007·10 cites·11 claims
- 1751US5512769AHigh breakdown voltage semiconductor device and method of fabricating the sameMATSUSHITA ELECTRONICS CORP·Filed 1994·Granted Apr 30, 1996·14 cites·13 claims
- 1850US10461001B2Method for manufacturing hermetic sealing lid member, and method for manufacturing electronic component housing packageHITACHI METALS LTD·Filed 2015·Granted Oct 29, 2019·0 cites·11 claims
- 1949US9350007B2Connection plate for battery terminals and method for manufacturing connection plate for battery terminalsODA YOSHIMITSU·Filed 2012·Granted May 24, 2016·1 cites·20 claims
- 2043US6943102B2Solder bump transfer sheet, method for producing the same, and methods for fabricating semiconductor device and printed boardNEOMAX CO LTD·Filed 2003·Granted Sep 13, 2005·0 cites·4 claims
- 2143US2015232244A1Cover material for hermetic sealing and package for containing electronic componentNEOMAX MATERIALS CO LTD·Filed 2013·Application pending·0 cites
- 2243US2004043088A1Process for producing germ extractFiled 2001·Application pending·0 cites
- 2342US6290746B1Method of producing metal ball and semiconductor packageSUMITOMO SPEC METALS·Filed 1999·Granted Sep 18, 2001·8 cites·3 claims
- 2441US6523178B1Video transmission systemFUJITSU LTD·Filed 1998·Granted Feb 18, 2003·9 cites·13 claims
- 2540US6677229B2Solder bump transfer sheet, method for producing the same, and methods for fabricating semiconductor device and printed boardSUMITOMO SPEC METALS·Filed 2001·Granted Jan 13, 2004·0 cites·6 claims
- 2640US5288826APolymer, surface modifier for inorganic materials and modified products thereofNIPPON PAINT CO LTD·Filed 1992·Granted Feb 22, 1994·5 cites·9 claims
- 2739US5863303AFuel oil composition for diesel enginesEXXON RESEARCH ENGINEERING CO·Filed 1998·Granted Jan 26, 1999·7 cites·11 claims
- 2837US2003101461A1Video transmission systemFiled 2003·Application pending·0 cites
- 2935US5058356ADecorative structureYAMAHA CORP·Filed 1989·Granted Oct 22, 1991·8 cites·2 claims
- 3031US8551623B2Airtightly sealing cap, electronic component storing package and method for manufacturing electronic component storing packageYAMAMOTO MASAHARU·Filed 2008·Granted Oct 8, 2013·0 cites·22 claims
- 3131US2008271908A1Hermetic Sealing Cap, Method of Manufacturing Hermetic Sealing Cap and Electronic Component Storage PackageNEOMAX MATERIALS CO LTD·Filed 2005·Application pending·0 cites
- 3229US2017367205A1Hermetic sealing lid member and electronic component housing packageHITACHI METALS NEOMATERIAL LTD·Filed 2016·Application pending·0 cites
- 3326US9959473B2Symbol recognition device and traffic sign recognition deviceUNIV HIROSHIMA·Filed 2016·Granted May 1, 2018·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →