Inventor · disambiguated record
Masaki Yazaki
Also filed as: YAZAKI MASAKI
11 granted patents·23 citations·filing 2011–2016
87Inventor score
Top patents by PatentIndex Score
11 records- 0190US9773960B2Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elementsDAINIPPON PRINTING CO LTD·Filed 2016·Granted Sep 26, 2017·5 cites·5 claims
- 0290US8933548B2Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elementsODA KAZUNORI·Filed 2011·Granted Jan 13, 2015·14 cites·12 claims
- 0379US9159655B2Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elementsDAINIPPON PRINTING CO LTD·Filed 2014·Granted Oct 13, 2015·3 cites·23 claims
- 0469US9214414B2Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elementsDAINIPPON PRINTING CO LTD·Filed 2014·Granted Dec 15, 2015·1 cites·2 claims
- 0561US9899583B2Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elementsDAINIPPON PRINTING CO LTD·Filed 2016·Granted Feb 20, 2018·0 cites·20 claims
- 0660US9553247B2Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elementsDAINIPPON PRINTING CO LTD·Filed 2015·Granted Jan 24, 2017·0 cites·17 claims
- 0759US9412923B2Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elementsDAINIPPON PRINTING CO LTD·Filed 2015·Granted Aug 9, 2016·0 cites·2 claims
- 0859US9362473B2Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elementsDAINIPPON PRINTING CO LTD·Filed 2015·Granted Jun 7, 2016·0 cites·7 claims
- 0952US9257306B2Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor deviceDAINIPPON PRINTING CO LTD·Filed 2014·Granted Feb 9, 2016·0 cites·30 claims
- 1051US9870983B2Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor deviceDAINIPPON PRINTING CO LTD·Filed 2016·Granted Jan 16, 2018·0 cites·17 claims
- 1149US9543169B2Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor deviceDAINIPPON PRINTING CO LTD·Filed 2016·Granted Jan 10, 2017·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →