Inventor · disambiguated record
Masachika Yoshino
Also filed as: YOSHINO MASACHIKA
18 granted patents·460 citations·filing 1985–2004
95Inventor score
Files withSHINETSU CHEMICAL CO18
Top patents by PatentIndex Score
18 records- 0195US6806509B2Light-emitting semiconductor potting composition and light-emitting semiconductor deviceSHINETSU CHEMICAL CO·Filed 2004·Granted Oct 19, 2004·111 cites·5 claims
- 0293US7026382B2Conductive resin compositionSHINETSU CHEMICAL CO·Filed 2003·Granted Apr 11, 2006·47 cites·8 claims
- 0389US4727168AAdhesion promotorSHINETSU CHEMICAL CO·Filed 1985·Granted Feb 23, 1988·40 cites·1 claims
- 0481US5519082ACurable silicone rubber composition and method for preparing silicone rubberSHINETSU CHEMICAL CO·Filed 1995·Granted May 21, 1996·37 cites·20 claims
- 0576US5066714ACurable organopolysiloxane putty-like compositionSHINETSU CHEMICAL CO·Filed 1989·Granted Nov 19, 1991·25 cites·23 claims
- 0673US5179148ASilicone rubber composition and method for the preparation thereofSHINETSU CHEMICAL CO·Filed 1991·Granted Jan 12, 1993·20 cites·14 claims
- 0773US4879339AStorage stable and room temperature-curable organopolysiloxane compositionSHINETSU CHEMICAL CO·Filed 1988·Granted Nov 7, 1989·43 cites·7 claims
- 0872US5367001AImpression compositionSHINETSU CHEMICAL CO·Filed 1993·Granted Nov 22, 1994·40 cites·9 claims
- 0970US7147920B2Wafer dicing/die bonding sheetSHINETSU CHEMICAL CO·Filed 2003·Granted Dec 12, 2006·18 cites·8 claims
- 1065US6949619B2Phenolic hydroxyl-bearing polyimide resin, making method and polyimide resin compositionSHINETSU CHEMICAL CO·Filed 2003·Granted Sep 27, 2005·11 cites·9 claims
- 1161US6969554B2Semiconductor sealing silicone composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2003·Granted Nov 29, 2005·10 cites·29 claims
- 1260US6518332B2Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewithSHINETSU CHEMICAL CO·Filed 2001·Granted Feb 11, 2003·9 cites·12 claims
- 1359US5246982ASilicone rubber compositionSHINETSU CHEMICAL CO·Filed 1992·Granted Sep 21, 1993·15 cites·15 claims
- 1453US6084037AEpoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 1997·Granted Jul 4, 2000·14 cites·2 claims
- 1551US7345105B2Conductive adhesive compositionSHINETSU CHEMICAL CO·Filed 2003·Granted Mar 18, 2008·3 cites·8 claims
- 1649US5563203ASilicone rubber compositions and cured products thereofSHINETSU CHEMICAL CO·Filed 1994·Granted Oct 8, 1996·11 cites·17 claims
- 1744US5340872ASilicone rubber compositions and their cured productsSHINETSU CHEMICAL CO·Filed 1993·Granted Aug 23, 1994·5 cites·9 claims
- 1828US6103026ACorrosion-resistant copper materials and making methodSHINETSU CHEMICAL CO·Filed 1998·Granted Aug 15, 2000·1 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →