Inventor · disambiguated record
Makoto Yoshino
Also filed as: YOSHINO MAKOTO
63 granted patents·24 pending applications·257 citations·filing 1986–2025
98Inventor score
Top patents by PatentIndex Score
87 records- 0195US9896330B2Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chipTEXAS INSTRUMENTS INC·Filed 2016·Granted Feb 20, 2018·12 cites·20 claims
- 0292US11227721B2Electronic componentTDK CORP·Filed 2017·Granted Jan 18, 2022·4 cites·7 claims
- 0392US7810848B2Pipe joint and pipe joint structure having the same and method of using the sameDENSO CORP·Filed 2007·Granted Oct 12, 2010·26 cites·30 claims
- 0491US12021019B2Semiconductor device package with thermal padTEXAS INSTRUMENTS INC·Filed 2021·Granted Jun 25, 2024·2 cites·20 claims
- 0588US10233074B2Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chipTEXAS INSTRUMENTS INC·Filed 2018·Granted Mar 19, 2019·4 cites·17 claims
- 0688US9293913B2ESD protection component and method for manufacturing ESD protection componentTDK CORP·Filed 2014·Granted Mar 22, 2016·8 cites·9 claims
- 0786US8724284B2Electrostatic protection componentUMEDA HIDENOBU·Filed 2012·Granted May 13, 2014·11 cites·18 claims
- 0884US10848119B2Electronic componentTDK CORP·Filed 2018·Granted Nov 24, 2020·2 cites·8 claims
- 0983US7178837B2Piping joint structureDENSO CORP·Filed 2005·Granted Feb 20, 2007·14 cites·12 claims
- 1083US2024339259A1Multilayer coil componentTDK CORP·Filed 2024·Application pending·0 cites
- 1182US11498831B2Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chipTEXAS INSTRUMENTS INC·Filed 2020·Granted Nov 15, 2022·1 cites·7 claims
- 1282US10723616B2Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chipTEXAS INSTRUMENTS INC·Filed 2019·Granted Jul 28, 2020·2 cites·19 claims
- 1380US10115515B2Multilayer common mode filterTDK CORP·Filed 2016·Granted Oct 30, 2018·2 cites·6 claims
- 1480US8048358B2Pop semiconductor device manufacturing methodTEXAS INSTRUMENTS INC·Filed 2009·Granted Nov 1, 2011·12 cites·11 claims
- 1580US6345647B2Fluid-impermeable composite hoseTOKAI RUBBER IND LTD·Filed 2001·Granted Feb 12, 2002·27 cites·20 claims
- 1678US2025253090A1Method for manufacturing multi-layer coil componentTDK CORP·Filed 2025·Application pending·0 cites
- 1776US10763231B2Bump bond structure for enhanced electromigration performanceTEXAS INSTRUMENTS INC·Filed 2018·Granted Sep 1, 2020·2 cites·12 claims
- 1875US12334247B2Multi-layer coil componentTDK CORP·Filed 2022·Granted Jun 17, 2025·0 cites·6 claims
- 1975US2024379509A1Heat-dissipating wirebonded members on package surfacesTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 2074US7007981B2Connecting structure of pipe and pipe joint and method of connecting the pipe to the pipe jointDENSO CORP·Filed 2003·Granted Mar 7, 2006·10 cites·12 claims
- 2173US9255657B2Pipe jointYOSHINO MAKOTO·Filed 2011·Granted Feb 9, 2016·4 cites·29 claims
- 2273US9231907B2Method for establishing connection between communication apparatuses, communication apparatus, and server apparatusYOSHINO MAKOTO·Filed 2012·Granted Jan 5, 2016·4 cites·7 claims
- 2372US8205667B2Heat exchanger with connectorYOSHINO MAKOTO·Filed 2008·Granted Jun 26, 2012·6 cites·13 claims
- 2472US7544436B2Fuel cellFUJITSU LTD·Filed 2007·Granted Jun 9, 2009·2 cites·15 claims
- 2571US2024347441A1Semiconductor device package with thermal padTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 2670US11127529B2Method of manufacturing laminated coil componentTDK CORP·Filed 2020·Granted Sep 21, 2021·0 cites·2 claims
- 2769US4746928AMicro-dot ink jet recorderHITACHI LTD·Filed 1986·Granted May 24, 1988·17 cites·5 claims
- 2868US11894195B2Electronic componentTDK CORP·Filed 2021·Granted Feb 6, 2024·0 cites·9 claims
- 2968US2025246349A1Coil componentTDK CORP·Filed 2024·Application pending·0 cites
- 3067US12040122B2Multilayer coil componentTDK CORP·Filed 2019·Granted Jul 16, 2024·0 cites·8 claims
- 3167US6439268B2Fluid-impermeable composite hoseTOKAI RUBBER IND LTD·Filed 2001·Granted Aug 27, 2002·15 cites·19 claims
- 3266US12347596B2Multi-layer inductorTDK CORP·Filed 2022·Granted Jul 1, 2025·0 cites·7 claims
- 3366US12046542B2Heat-dissipating wirebonded members on package surfacesTEXAS INSTRUMENTS INC·Filed 2021·Granted Jul 23, 2024·0 cites·15 claims
- 3466US8466757B2Multilayer common mode filterYOSHINO MAKOTO·Filed 2010·Granted Jun 18, 2013·3 cites·6 claims
- 3566US2025299857A1Coil componentTDK CORP·Filed 2025·Application pending·0 cites
- 3665US7837234B2Pipe joint unit and method of manufacturing the sameDENSO CORP·Filed 2007·Granted Nov 23, 2010·5 cites·14 claims
- 3765US7611171B2Piping joint deviceDENSO CORP·Filed 2006·Granted Nov 3, 2009·8 cites·7 claims
- 3865US2024331911A1Coil componentTDK CORP·Filed 2024·Application pending·0 cites
- 3965US2025292951A1Coil componentTDK CORP·Filed 2025·Application pending·0 cites
- 4064US9667036B2ESD protection componentTDK CORP·Filed 2014·Granted May 30, 2017·1 cites·4 claims
- 4163US10665388B2Method of manufacturing laminated coil componentTDK CORP·Filed 2017·Granted May 26, 2020·0 cites·3 claims
- 4263US2024120142A1Electronic componentTDK CORP·Filed 2023·Application pending·0 cites
- 4362US12512242B2Multilayer coil componentTDK CORP·Filed 2022·Granted Dec 30, 2025·0 cites·8 claims
- 4462US12094642B2Multilayer inductor componentTDK CORP·Filed 2021·Granted Sep 17, 2024·0 cites·16 claims
- 4562US11450638B2Bump bond structure for enhanced electromigration performanceTEXAS INSTRUMENTS INC·Filed 2020·Granted Sep 20, 2022·0 cites·15 claims
- 4662US2024331929A1Coil componentTDK CORP·Filed 2024·Application pending·0 cites
- 4762US2025029774A1Coil componentTDK CORP·Filed 2024·Application pending·0 cites
- 4861US12347597B2Multi-layer inductorTDK CORP·Filed 2022·Granted Jul 1, 2025·0 cites·4 claims
- 4961US11527350B2Multilayer coil componentTDK CORP·Filed 2019·Granted Dec 13, 2022·0 cites·3 claims
- 5061US8957744B2Multilayer common mode filterTDK CORP·Filed 2013·Granted Feb 17, 2015·2 cites·4 claims
Showing the top 50 of 87 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →