Inventor · disambiguated record
Md Hasnine
Also filed as: HASNINE MD
6 granted patents·11 pending applications·0 citations·filing 2018–2025
67Inventor score
Top patents by PatentIndex Score
17 records- 0182US12421574B2High reliability lead-free solder alloy for electronic applications in extreme environmentsALPHA ASSEMBLY SOLUTIONS INC·Filed 2023·Granted Sep 23, 2025·0 cites·10 claims
- 0277US2023356333A1Cost-effective lead-free solder alloy for electronic applicationsALPHA ASSEMBLY SOLUTIONS INC·Filed 2023·Application pending·0 cites
- 0369US11724342B2Cost-effective lead-free solder alloy for electronic applicationsKESTER LLC·Filed 2021·Granted Aug 15, 2023·0 cites·4 claims
- 0466US11123823B2Cost-effective lead-free solder alloy for electronic applicationsKESTER LLC·Filed 2018·Granted Sep 21, 2021·0 cites·17 claims
- 0563US11732330B2High reliability lead-free solder alloy for electronic applications in extreme environmentsALPHA ASSEMBLY SOLUTIONS INC·Filed 2018·Granted Aug 22, 2023·0 cites·11 claims
- 0660US2025266800A1Acoustic resonator packageQORVO US INC·Filed 2024·Application pending·0 cites
- 0759US11577343B2Low-silver alternative to standard SAC alloys for high reliability applicationsALPHA ASSEMBLY SOLUTIONS INC·Filed 2018·Granted Feb 14, 2023·0 cites·12 claims
- 0856US2025022765A1Top side cooling for power amplifier moduleQORVO US INC·Filed 2024·Application pending·0 cites
- 0952US2025391713A1Double-sided air-cavity package with top-side coolingQORVO US INC·Filed 2025·Application pending·0 cites
- 1050US12512375B2System in a package (SIP) with air cavityQORVO US INC·Filed 2022·Granted Dec 30, 2025·0 cites·13 claims
- 1150US2023402333A1System in a package (sip) with air cavity and epoxy sealQORVO US INC·Filed 2023·Application pending·0 cites
- 1250US2025336753A1Air cavity package and methods for forming sameQORVO US INC·Filed 2025·Application pending·0 cites
- 1349US2025336785A1Double-sided high-power modules with air cavityQORVO US INC·Filed 2025·Application pending·0 cites
- 1449US2023343721A1Multichip module thermal management through backside metalQORVO US INC·Filed 2023·Application pending·0 cites
- 1547US2023317554A1Embedded heat slug in a substrateQORVO US INC·Filed 2023·Application pending·0 cites
- 1643US2025323113A1Thermal management of high-power devices and structures thereofQORVO US INC·Filed 2025·Application pending·0 cites
- 1740US2025329603A1Cte matched coined lid for air-cavity package top-side coolingQORVO US INC·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →