Inventor · disambiguated record
Mee-Hyun Ahn
Also filed as: AHN MEE-HYUN
2 granted patents·4 pending applications·10 citations·filing 2002–2009
56Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0157US6806582B2PAD arrangement in semiconductor memory device and method of driving semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Oct 19, 2004·8 cites·11 claims
- 0248US2009230520A1Leadframe package with dual lead configurationsLEE JONG-JOO·Filed 2009·Application pending·0 cites
- 0343US7200067B2Pad arrangement in semiconductor memory device and method of driving semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Apr 3, 2007·2 cites·4 claims
- 0443US2007040247A1Leadframe package with dual lead configurationsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 0537US2006103002A1Semiconductor packages with asymmetric connection configurationsAHN MEE-HYUN·Filed 2005·Application pending·0 cites
- 0633US2005104184A1Semiconductor chip package and methodFiled 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Mee-Hyun Ahn files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →