Inventor · disambiguated record
Mengyi Cao
Also filed as: CAO MENGYI
2 granted patents·1 pending application·0 citations·filing 2012–2021
22Inventor score
Top patents by PatentIndex Score
3 records- 0142US11984407B2Package structure and communications device with suppressed ion migration in bonding materialHUAWEI TECH CO LTD·Filed 2021·Granted May 14, 2024·0 cites·20 claims
- 0231US2020294892A1Package structure and communications deviceHUAWEI TECH CO LTD·Filed 2020·Application pending·0 cites
- 0328US9826821B2Broom and manufacturing method thereofWUHAN YANGYANG YUANLV MINI-RESERVOIRS CO LTD·Filed 2012·Granted Nov 28, 2017·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →