Inventor · disambiguated record
Meng-Chang Chan
Also filed as: CHAN MENG B · CHAN MENG-CHANG
4 granted patents·1 pending application·13 citations·filing 2004–2020
63Inventor score
Top patents by PatentIndex Score
5 records- 0191US10483235B2Stacked electronic device and method for fabricating the sameWINBOND ELECTRONICS CORP·Filed 2016·Granted Nov 19, 2019·13 cites·12 claims
- 0260US11557595B2Memory deviceWINBOND ELECTRONICS CORP·Filed 2020·Granted Jan 17, 2023·0 cites·11 claims
- 0354US10756099B2Memory device and method for manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2019·Granted Aug 25, 2020·0 cites·8 claims
- 0441US9881901B2Stacked package device and method for fabricating the sameWINBOND ELECTRONICS CORP·Filed 2016·Granted Jan 30, 2018·0 cites·7 claims
- 0535US2005167790A1Integrated circuit package with transparent encapsulant and method for making thereofCARSEM M SDN BHD·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →