Inventor · disambiguated record

Meng How Chong

Also filed as: CHONG MENG HOW

1 granted patent·2 pending applications·0 citations·filing 2019–2024

8Inventor score

Technology areasH10W

Files withINFINEON TECHNOLOGIES AG3

Top patents by PatentIndex Score

3 records

0150US2024387305A1Semiconductor package having a die pad and an encapsulation with trenches and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
0241US2022115245A1Power semiconductor package and method for fabricating a power semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
0337US11362023B2Package lead design with grooves for improved dambar separationINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jun 14, 2022·0 cites·17 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →