Inventor · disambiguated record
Melvin Joseph Desilva
Also filed as: DESILVA MELVIN · DESILVA MELVIN J · DESILVA MELVIN JOSEPH
13 granted patents·920 citations·filing 1995–2001
94Inventor score
Top patents by PatentIndex Score
13 records- 0197US5824599AProtected encapsulation of catalytic layer for electroless copper interconnectCORNELL RES FOUNDATION INC·Filed 1996·Granted Oct 20, 1998·561 cites·22 claims
- 0294US6124765AIntegrated released beam oscillator and associated methodsST MICROELECTRONICS INC·Filed 1997·Granted Sep 26, 2000·104 cites·67 claims
- 0386US6278337B1Integrated released beam oscillator and associated methodsST MICROELECTRONICS INC·Filed 1999·Granted Aug 21, 2001·44 cites·25 claims
- 0483US6235550B1Integrated sensor having plurality of released beams for sensing acceleration and associated methodsST MICROELECTRONICS INC·Filed 2000·Granted May 22, 2001·26 cites·12 claims
- 0579US5917226AIntegrated released beam, thermo-mechanical sensor for sensing temperature variations and associated methodsST MICROELECTRONICS INC·Filed 1997·Granted Jun 29, 1999·49 cites·40 claims
- 0672US6058778AIntegrated sensor having plurality of released beams for sensing accelerationST MICROELECTRONICS INC·Filed 1997·Granted May 9, 2000·25 cites·32 claims
- 0770US5703341AMethod for adhesion of metal films to ceramicsLOCKHEED MARTIN ENERGY SYS INC·Filed 1995·Granted Dec 30, 1997·32 cites·35 claims
- 0865US6028343AIntegrated released beam sensor for sensing acceleration and associated methodsST MICROELECTRONICS INC·Filed 1997·Granted Feb 22, 2000·22 cites·16 claims
- 0960US6750775B2Integrated sensor having plurality of released beams for sensing acceleration and associated methodsFiled 2001·Granted Jun 15, 2004·9 cites·1 claims
- 1056US6218209B1Integrated released beam sensor for sensing acceleration and associated methodsST MICROELECTRONICS INC·Filed 1999·Granted Apr 17, 2001·14 cites·13 claims
- 1153US6171879B1Methods of forming thermo-mechanical sensorST MICROELECTRONICS INC·Filed 1998·Granted Jan 9, 2001·18 cites·16 claims
- 1244US5926736ALow temperature aluminum reflow for multilevel metallizationST MICROELECTRONICS INC·Filed 1996·Granted Jul 20, 1999·10 cites·21 claims
- 1338US6215188B1Low temperature aluminum reflow for multilevel metallizationST MICROELECTRONICS INC·Filed 1997·Granted Apr 10, 2001·6 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →