Inventor · disambiguated record
Meow Koon Eng
Also filed as: ENG MEOW KOON
32 granted patents·3 pending applications·838 citations·filing 2002–2021
98Inventor score
Top patents by PatentIndex Score
35 records- 0199US7855462B2Packaged semiconductor assemblies and methods for manufacturing such assembliesMICRON TECHNOLOGY INC·Filed 2007·Granted Dec 21, 2010·148 cites·23 claims
- 0298US7485562B2Method of making multichip wafer level packages and computing systems incorporating sameMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 3, 2009·141 cites·18 claims
- 0397US6882021B2Packaged image sensing microelectronic devices including a lead and methods of packaging image sensing microelectronic devices including a leadMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 19, 2005·157 cites·38 claims
- 0496US7193312B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted Mar 20, 2007·32 cites·13 claims
- 0594US7791203B2Interconnects for packaged semiconductor devices and methods for manufacturing such devicesMICRON TECHNOLOGY INC·Filed 2007·Granted Sep 7, 2010·26 cites·18 claims
- 0694US7633159B2Semiconductor device assemblies and packages with edge contacts and sacrificial substrates and other intermediate structures used or formed in fabricating the assemblies or packagesMICRON TECHNOLOGY INC·Filed 2005·Granted Dec 15, 2009·26 cites·27 claims
- 0793US7208335B2Castellated chip-scale packages and methods for fabricating the sameMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 24, 2007·62 cites·72 claims
- 0892US6964881B2Multi-chip wafer level system packages and methods of forming sameMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 15, 2005·51 cites·13 claims
- 0991US7173330B2Multiple chip semiconductor packageMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 6, 2007·17 cites·21 claims
- 1090US7843050B2Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2007·Granted Nov 30, 2010·12 cites·18 claims
- 1190US6825553B2Multichip wafer level packages and computing systems incorporating sameMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 30, 2004·44 cites·26 claims
- 1286US9165910B2Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Oct 20, 2015·4 cites·18 claims
- 1386US6958537B2Multiple chip semiconductor packageMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 25, 2005·32 cites·18 claims
- 1484US6987031B2Multiple chip semiconductor package and method of fabricating sameMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 17, 2006·27 cites·32 claims
- 1583US8063493B2Semiconductor device assemblies and packagesBOON SUAN JEUNG·Filed 2009·Granted Nov 22, 2011·9 cites·20 claims
- 1682US7087992B2Multichip wafer level packages and computing systems incorporating sameMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 8, 2006·21 cites·25 claims
- 1779US8232657B2Packaged semiconductor assemblies and methods for manufacturing such assembliesBOON SUAN JEUNG·Filed 2010·Granted Jul 31, 2012·3 cites·10 claims
- 1879US8198720B2Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methodsENG MEOW KOON·Filed 2010·Granted Jun 12, 2012·3 cites·11 claims
- 1979US7304375B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted Dec 4, 2007·5 cites·12 claims
- 2077US9911696B2Packaged semiconductor assemblies and methods for manufacturing such assembliesMICRON TECHNOLOGY INC·Filed 2014·Granted Mar 6, 2018·2 cites·18 claims
- 2177US8525320B2Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methodsENG MEOW KOON·Filed 2011·Granted Sep 3, 2013·4 cites·18 claims
- 2276US2022013460A1Packaged semiconductor assemblies and methods for manufacturing such assembliesMICRON TECHNOLOGY INC·Filed 2021·Application pending·0 cites
- 2373US9653444B2Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2015·Granted May 16, 2017·1 cites·14 claims
- 2472US7659134B2Microelectronic imagers and methods for manufacturing such microelectronic imagersAPTINA IMAGING CORP·Filed 2007·Granted Feb 9, 2010·5 cites·20 claims
- 2572US2020243444A1Packaged semiconductor assemblies and methods for manufacturing such assembliesMICRON TECHNOLOGY INC·Filed 2020·Application pending·0 cites
- 2671US8906744B2Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2013·Granted Dec 9, 2014·1 cites·18 claims
- 2769US8536702B2Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methodsENG MEOW KOON·Filed 2012·Granted Sep 17, 2013·1 cites·13 claims
- 2869US7271027B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 18, 2007·2 cites·18 claims
- 2965US10396059B2Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 27, 2019·0 cites·20 claims
- 3064US10622308B2Packaged semiconductor assemblies and methods for manufacturing such assembliesMICRON TECHNOLOGY INC·Filed 2018·Granted Apr 14, 2020·0 cites·20 claims
- 3164US9418872B2Packaged microelectronic componentsMICRON TECHNOLOGY INC·Filed 2014·Granted Aug 16, 2016·1 cites·21 claims
- 3262US10056359B2Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Aug 21, 2018·0 cites·18 claims
- 3362US7553697B2Multiple chip semiconductor packageMICRON TECHNOLOGY INC·Filed 2006·Granted Jun 30, 2009·1 cites·16 claims
- 3453US8445330B2Interconnects for packaged semiconductor devices and methods for manufacturing such devicesBOON SUAN JEUNG·Filed 2012·Granted May 21, 2013·0 cites·20 claims
- 3543US2004229400A1Multichip wafer level system packages and methods of forming sameFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →