Inventor · disambiguated record
Merrill Albert Hatcher, Jr.
Also filed as: HATCHER JR MERRILL ALBERT · HATCHER MERRILL A · HATCHER MERRILL ALBERT
23 granted patents·198 citations·filing 2001–2022
94Inventor score
Top patents by PatentIndex Score
23 records- 0197US10882740B2Wafer-level package with enhanced performance and manufacturing method thereofQORVO US INC·Filed 2019·Granted Jan 5, 2021·25 cites·16 claims
- 0291US6649446B1Hermetic package for multiple contact-sensitive electronic devices and methods of manufacturing thereofCLARISAY INC·Filed 2001·Granted Nov 18, 2003·78 cites·18 claims
- 0386US8313985B2Atomic layer deposition encapsulation for power amplifiers in RF circuitsHATCHER JR MERRILL ALBERT·Filed 2011·Granted Nov 20, 2012·9 cites·28 claims
- 0484US10103080B2Thermally enhanced semiconductor package with thermal additive and process for making the sameQORVO US INC·Filed 2016·Granted Oct 16, 2018·4 cites·18 claims
- 0584US8492908B2Atomic layer deposition encapsulation for power amplifiers in RF circuitsRF MICRO DEVICES INC·Filed 2012·Granted Jul 23, 2013·6 cites·4 claims
- 0684US8440012B2Atomic layer deposition encapsulation for acoustic wave devicesHATCHER JR MERRILL ALBERT·Filed 2011·Granted May 14, 2013·7 cites·13 claims
- 0784US6507097B1Hermetic package for pyroelectric-sensitive electronic device and method of manufacturing the sameCLARISAY INC·Filed 2001·Granted Jan 14, 2003·28 cites·21 claims
- 0882US6621379B1Hermetic package for surface acoustic wave device and method of manufacturing the sameCLARISAY INC·Filed 2001·Granted Sep 16, 2003·24 cites·29 claims
- 0976US10773952B2Wafer-level package with enhanced performanceQORVO US INC·Filed 2017·Granted Sep 15, 2020·2 cites·22 claims
- 1075US11387157B2RF devices with enhanced performance and methods of forming the sameQORVO US INC·Filed 2019·Granted Jul 12, 2022·2 cites·20 claims
- 1169US12368056B2RF devices with enhanced performance and methods of forming the sameQORVO US INC·Filed 2022·Granted Jul 22, 2025·0 cites·27 claims
- 1269US10486963B2Wafer-level package with enhanced performanceQORVO US INC·Filed 2017·Granted Nov 26, 2019·1 cites·22 claims
- 1369US9349938B2Atomic layer deposition encapsulation for acoustic wave devicesRF MICRO DEVICES INC·Filed 2013·Granted May 24, 2016·0 cites·4 claims
- 1464US6639150B1Hermetic package for surface acoustic wave device having exposed device substrate contacts and method of manufacturing the sameCLARISAY INC·Filed 2002·Granted Oct 28, 2003·12 cites·32 claims
- 1556US12046483B2RF devices with enhanced performance and methods of forming the sameQORVO US INC·Filed 2019·Granted Jul 23, 2024·0 cites·21 claims
- 1656US11063021B2Microelectronics package with vertically stacked diesQORVO US INC·Filed 2019·Granted Jul 13, 2021·0 cites·20 claims
- 1755US10755992B2Wafer-level packaging for enhanced performanceQORVO US INC·Filed 2018·Granted Aug 25, 2020·0 cites·24 claims
- 1854US10804179B2Wafer-level package with enhanced performanceQORVO US INC·Filed 2018·Granted Oct 13, 2020·0 cites·17 claims
- 1954US10490471B2Wafer-level packaging for enhanced performanceQORVO US INC·Filed 2018·Granted Nov 26, 2019·0 cites·22 claims
- 2053US10804246B2Microelectronics package with vertically stacked diesQORVO US INC·Filed 2018·Granted Oct 13, 2020·0 cites·22 claims
- 2152US9082953B2Atomic layer deposition encapsulation for acoustic wave devicesRF MICRO DEVICES INC·Filed 2013·Granted Jul 14, 2015·0 cites·10 claims
- 2251US10262915B2Thermally enhanced semiconductor package with thermal additive and process for making the sameQORVO US INC·Filed 2018·Granted Apr 16, 2019·0 cites·16 claims
- 2351US10109550B2Wafer-level package with enhanced performanceQORVO US INC·Filed 2017·Granted Oct 23, 2018·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →