Inventor · disambiguated record
Meng-Jou He
Also filed as: HE MENG · HE MENG-JOU
2 granted patents·1 pending application·1 citations·filing 2023–2023
31Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0149US12469774B2Electronic package and substrate structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Nov 11, 2025·0 cites·9 claims
- 0246US2024282689A1Electronic package, packaging substrate and fabricating method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 0345USD1079747SDisplay screen or portion thereof with iconGOOGLE LLC·Filed 2023·Granted Jun 17, 2025·1 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →