Inventor · disambiguated record
Mei-Lin Hsieh
Also filed as: HSIEH MEI-LIN
4 granted patents·2 pending applications·1 citations·filing 2007–2019
55Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0162US11450596B2Lead frame, package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Sep 20, 2022·1 cites·10 claims
- 0245US11139225B2Device including a plurality of leads surrounding a die paddle and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Oct 5, 2021·0 cites·22 claims
- 0341US2008185698A1Semiconductor package structure and carrier structureADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 0440US8592962B2Semiconductor device packages with protective layer and related methodsCHEN KUANG-HSIUNG·Filed 2011·Granted Nov 26, 2013·0 cites·17 claims
- 0540US2008230882A1Chip package structureHSIEH MEI-LIN·Filed 2008·Application pending·0 cites
- 0629US8304865B2Leadframe and chip packageHSU YUEH-CHEN·Filed 2010·Granted Nov 6, 2012·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →