Inventor · disambiguated record
Meng-Chi Huang
Also filed as: HUANG MENG-CHI
10 granted patents·11 pending applications·3 citations·filing 2006–2024
78Inventor score
Top patents by PatentIndex Score
21 records- 0170US9499911B2Method for forming metal circuit, liquid trigger material for forming metal circuit and metal circuit structureIND TECH RES INST·Filed 2014·Granted Nov 22, 2016·0 cites·24 claims
- 0268US2025214055A1Ceramic electrode structure and ozone generatorIND TECH RES INST·Filed 2024·Application pending·0 cites
- 0365US12389535B2Three-dimensional circuit board, manufacturing method thereof, and probe cardIND TECH RES INST·Filed 2022·Granted Aug 12, 2025·0 cites·14 claims
- 0465US9683292B2Metal circuit structureIND TECH RES INST·Filed 2016·Granted Jun 20, 2017·0 cites·13 claims
- 0564US9642250B1Insulating colloidal material and multilayer circuit structureIND TECH RES INST·Filed 2015·Granted May 2, 2017·1 cites·10 claims
- 0663US11959941B2Probe cardIND TECH RES INST·Filed 2021·Granted Apr 16, 2024·0 cites·18 claims
- 0757US9590292B2Beam antennaIND TECH RES INST·Filed 2015·Granted Mar 7, 2017·1 cites·23 claims
- 0855US10020569B2Laminated antenna structureIND TECH RES INST·Filed 2015·Granted Jul 10, 2018·1 cites·28 claims
- 0953US2024164069A1Ceramic substrate structure and power module having the sameIND TECH RES INST·Filed 2022·Application pending·0 cites
- 1052US10051737B2Multilayer circuit structureIND TECH RES INST·Filed 2017·Granted Aug 14, 2018·0 cites·15 claims
- 1150US2022177364A1Adhesion promoting layer, method for depositing conductive layer on inorganic or organic-inorganic hybrid substrate, and conductive structureIND TECH RES INST·Filed 2021·Application pending·0 cites
- 1249US10669209B2Ceramic device and manufacturing method thereofIND TECH RES INST·Filed 2017·Granted Jun 2, 2020·0 cites·18 claims
- 1344US2009246717A1Method for forming a patterned photoresist layerIND TECH RES INST·Filed 2008·Application pending·0 cites
- 1444US2008094084A1Multi-layer electric probe and fabricating method thereofIND TECH RES INST·Filed 2006·Application pending·0 cites
- 1542US2010281679A1Fabricating method for multi-layer electric probeIND TECH RES INST·Filed 2010·Application pending·0 cites
- 1641US2013170203A1Light-emitting diode array light source and optical engine having the sameCHENG KUEI-YUAN·Filed 2012·Application pending·0 cites
- 1740US2015014719A1Light-emitting diode chipIND TECH RES INST·Filed 2013·Application pending·0 cites
- 1840US2014175495A1Die bonding method and die bonding structure of light emitting diode packageIND TECH RES INST·Filed 2013·Application pending·0 cites
- 1939US8659160B2Die structure, manufacturing method and substrate thereofHUANG MENG-CHI·Filed 2011·Granted Feb 25, 2014·0 cites·17 claims
- 2039US2015060932A1Liquid-filled packaging structure of heating componentIND TECH RES INST·Filed 2014·Application pending·0 cites
- 2127US2017173718A1Metal patch, method for manufacturing the same and bonding method by using the sameIND TECH RES INST·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →