Inventor · disambiguated record
Meng An Jung
Also filed as: JUNG MENG A · JUNG MENG AN
7 granted patents·4 pending applications·25 citations·filing 2003–2018
80Inventor score
Files withDONGBU ELECTRONICS CO LTD3DONGBU HITEK CO LTD2MAGNACHIP SEMICONDUCTOR LTD2DONGBU ELECTRONICCS CO LTD1DONGBUANAM SEMICONDUCTOR INC1
Top patents by PatentIndex Score
11 records- 0185US9922865B2Semiconductor device and manufacturing method thereofMAGNACHIP SEMICONDUCTOR LTD·Filed 2013·Granted Mar 20, 2018·8 cites·11 claims
- 0285US7579639B2CMOS image sensor and method for fabricating the sameDONGBU ELECTRONICS CO LTD·Filed 2005·Granted Aug 25, 2009·10 cites·11 claims
- 0368US7727812B2Singulation method of semiconductor deviceDONGBU HITEK CO LTD·Filed 2007·Granted Jun 1, 2010·3 cites·12 claims
- 0457US2009325338A1CMOS image sensor and method for fabricating the sameJUNG MENG AN·Filed 2009·Application pending·0 cites
- 0552US10395972B2Semiconductor device and manufacturing method thereofMAGNACHIP SEMICONDUCTOR LTD·Filed 2018·Granted Aug 27, 2019·0 cites·29 claims
- 0645US7094519B2Method of manufacturing a CMOS image sensorDONGBU ELECTRONICS CO LTD·Filed 2003·Granted Aug 22, 2006·2 cites·18 claims
- 0743US2008090180A1Method of fabricating semiconductor deviceDONGBU HITEK CO LTD·Filed 2007·Application pending·0 cites
- 0842US2006125020A1CMOS image sensor and method for fabricating the sameJUNG MENG A·Filed 2005·Application pending·0 cites
- 0940US7267603B2Back grinding methods for fabricating an image sensorDONGBU ELECTRONICCS CO LTD·Filed 2004·Granted Sep 11, 2007·2 cites·8 claims
- 1036US7297624B2Semiconductor device and method for fabricating the sameDONGBU ELECTRONICS CO LTD·Filed 2004·Granted Nov 20, 2007·0 cites·11 claims
- 1136US2006024944A1Metal pad of semiconductor device and method for bonding the metal padDONGBUANAM SEMICONDUCTOR INC·Filed 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Meng An Jung files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →