Inventor · disambiguated record
Megumi Kamono
Also filed as: KAMONO Megumi
0 granted patents·2 pending applications·0 citations·filing 2020–2021
Technology areasH10P
Top patents by PatentIndex Score
2 records- 0140US2024043722A1Film-like adhesive agent, dicing/die-bonding all-in-one film, semiconductor device, and method for manufacturing sameRESONAC CORP·Filed 2021·Application pending·0 cites
- 0235US2023395420A1Film adhesive and method for making same; dicing/die bonding integrated film and method for making same; and semiconductor device and method for making sameSHOWA DENKO MATERIALS CO LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →