Inventor · disambiguated record
Meng Chi Lee
Also filed as: LEE MENG CHI
22 granted patents·2 pending applications·92 citations·filing 2012–2022
93Inventor score
Top patents by PatentIndex Score
24 records- 0196US9721903B2Vertical interconnects for self shielded system in package (SiP) modulesAPPLE INC·Filed 2015·Granted Aug 1, 2017·31 cites·20 claims
- 0295US9917335B2Methods for determining and controlling battery expansionAPPLE INC·Filed 2015·Granted Mar 13, 2018·20 cites·22 claims
- 0392US10356903B1System-in-package including opposing circuit boardsAPPLE INC·Filed 2018·Granted Jul 16, 2019·9 cites·20 claims
- 0488US11164694B2Low-spurious electric-field inductor designAPPLE INC·Filed 2019·Granted Nov 2, 2021·6 cites·24 claims
- 0588US10115677B2Vertical interconnects for self shielded system in package (SiP) modulesAPPLE INC·Filed 2017·Granted Oct 30, 2018·5 cites·18 claims
- 0687US10847846B2Methods for determining and controlling battery expansionAPPLE INC·Filed 2018·Granted Nov 24, 2020·2 cites·24 claims
- 0786US10522475B2Vertical interconnects for self shielded system in package (SiP) modulesAPPLE INC·Filed 2018·Granted Dec 31, 2019·4 cites·19 claims
- 0883US10709018B2System-in-package including opposing circuit boardsAPPLE INC·Filed 2019·Granted Jul 7, 2020·3 cites·21 claims
- 0983US10624214B2Low-profile space-efficient shielding for SIP moduleAPPLE INC·Filed 2016·Granted Apr 14, 2020·3 cites·20 claims
- 1077US10631410B2Stacked printed circuit board packagesAPPLE INC·Filed 2017·Granted Apr 21, 2020·2 cites·16 claims
- 1176US12041728B2Selective soldering with photonic soldering technologyAPPLE INC·Filed 2021·Granted Jul 16, 2024·1 cites·20 claims
- 1274US11539086B2Methods for determining and controlling battery expansionAPPLE INC·Filed 2020·Granted Dec 27, 2022·0 cites·20 claims
- 1374US10455707B1Connection pad for embedded components in PCB packagingAPPLE INC·Filed 2018·Granted Oct 22, 2019·3 cites·23 claims
- 1467US10966321B2System-in-package including opposing circuit boardsAPPLE INC·Filed 2020·Granted Mar 30, 2021·0 cites·20 claims
- 1565US10535611B2Substrate-less integrated componentsAPPLE INC·Filed 2016·Granted Jan 14, 2020·1 cites·18 claims
- 1664US9262992B2Multiple hardware paths for backlight control in computer systemsAPPLE INC·Filed 2012·Granted Feb 16, 2016·1 cites·22 claims
- 1760US10109593B2Self shielded system in package (SiP) modulesAPPLE INC·Filed 2015·Granted Oct 23, 2018·1 cites·18 claims
- 1859US12035466B2Systems and methods for manufacturing thin substrateAPPLE INC·Filed 2021·Granted Jul 9, 2024·0 cites·29 claims
- 1956US10991659B2Substrate-less integrated componentsAPPLE INC·Filed 2019·Granted Apr 27, 2021·0 cites·18 claims
- 2050US2023420413A1Microelectronic assemblies including solder and non-solder interconnectsINTEL CORP·Filed 2022·Application pending·0 cites
- 2148US2023063808A1Coaxial via shielded interposerAPPLE INC·Filed 2021·Application pending·0 cites
- 2246US10296058B2EMI shielding for disconnected contactsAPPLE INC·Filed 2016·Granted May 21, 2019·0 cites·20 claims
- 2344US10147685B2System-in-package devices with magnetic shieldingAPPLE INC·Filed 2017·Granted Dec 4, 2018·0 cites·30 claims
- 2434US9839133B2Low-area overhead connectivity solutions to SIP moduleAPPLE INC·Filed 2015·Granted Dec 5, 2017·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →