Inventor · disambiguated record
Meng-Tsan Lee
Also filed as: LEE MENG-TSAN
14 granted patents·9 pending applications·126 citations·filing 2017–2025
91Inventor score
Top patents by PatentIndex Score
23 records- 0198US10163802B2Fan-out package having a main die and a dummy die, and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·76 cites·20 claims
- 0297US10510674B2Fan-out package having a main die and a dummy die, and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·20 cites·20 claims
- 0395US11967563B2Fan-out package having a main die and a dummy dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 23, 2024·2 cites·20 claims
- 0495US9972581B1Routing design of dummy metal cap and redistribution lineTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 15, 2018·14 cites·20 claims
- 0594US2025364427A1Fan-Out Package Having a Main Die and a Dummy DieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0693US10354961B2Routing design of dummy metal cap and redistribution lineTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 16, 2019·8 cites·20 claims
- 0792US11094641B2Fan-out package having a main die and a dummy dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 17, 2021·4 cites·20 claims
- 0888US11581268B2Semiconductor package with redistribution structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 14, 2023·1 cites·20 claims
- 0987US12224247B2Fan-out package having a main die and a dummy dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 11, 2025·0 cites·20 claims
- 1084US12506087B2Semiconductor package with redistribution structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 23, 2025·0 cites·20 claims
- 1180US11955439B2Semiconductor package with redistribution structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 9, 2024·0 cites·20 claims
- 1280US2025183191A1Fan-Out Package Having a Main Die and a Dummy DieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1379US2025357234A1PACKAGING OF DIES INCLUDING TSVs USING SACRIFICIAL CARRIERTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1478US2025357367A1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1573US11031352B2Routing design of dummy metal cap and redistribution lineTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 8, 2021·1 cites·20 claims
- 1670US12394754B2Device and method for UBM/RDL routingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 19, 2025·0 cites·20 claims
- 1769US2024339370A1Packaging of Dies Including TSVs using Sacrificial CarrierTAIWAN SEMICONDUCTOR MANUFACTORING CO LTD·Filed 2023·Application pending·0 cites
- 1862US12322727B2Device and method for UBM/RDL routingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 3, 2025·0 cites·20 claims
- 1960US2025343125A1Semiconductor structures and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2060US2025357262A1Package assembly and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2159US2025300154A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2255US2024178095A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2354US11195802B2Semiconductor package including shielding plate in redistribution structure, semiconductor package including conductive via in redistribution structure, and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 7, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →