Inventor · disambiguated record
Meng Li
Also filed as: LI MENG · LI MENG-HSIEN
10 granted patents·1 pending application·4 citations·filing 2017–2022
78Inventor score
Top patents by PatentIndex Score
11 records- 0192US11841191B2Magnesium alloy material smelting deviceCITIC DICASTAL CO LTD·Filed 2022·Granted Dec 12, 2023·2 cites·9 claims
- 0290US12046476B2Wet etching chemistry and method of forming semiconductor device using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 23, 2024·2 cites·20 claims
- 0364US12494432B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 9, 2025·0 cites·20 claims
- 0462US12091736B2Spinning process of magnesium alloy wheel hubCITIC DICASTAL CO LTD·Filed 2022·Granted Sep 17, 2024·0 cites·8 claims
- 0562US11660659B2Forging process of magnesium alloy wheel hubCITIC DICASTAL CO LTD·Filed 2022·Granted May 30, 2023·0 cites·3 claims
- 0660US11981985B2Method for manufacturing special vehicle wheels with 7000 series aluminum alloyCITIC DICASTAL CO LTD·Filed 2022·Granted May 14, 2024·0 cites·2 claims
- 0760US11905577B2Magnesium alloy for wheel and preparation method thereofCITIC DICASTAL CO LTD·Filed 2022·Granted Feb 20, 2024·0 cites·7 claims
- 0859US12305920B2Aluminum alloy material smelting deviceCITIC DICASTAL CO LTD·Filed 2022·Granted May 20, 2025·0 cites·5 claims
- 0956US11745252B2Method of producing a magnesium alloy wheel hubCITIC DICASTAL CO LTD·Filed 2022·Granted Sep 5, 2023·0 cites·9 claims
- 1050US10770314B2Semiconductor device, tool, and method of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 8, 2020·0 cites·20 claims
- 1150US2019096703A1Semiconductor Device, Tool, and Method of ManufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Meng Li files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →