Inventor · disambiguated record
Meehyun Lim
Also filed as: LIM MEEHYUN
5 granted patents·8 pending applications·6 citations·filing 2020–2025
68Inventor score
Files withSAMSUNG ELECTRONICS CO LTD13
Top patents by PatentIndex Score
13 records- 0191US11782085B2Semiconductor test device and system and test method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 10, 2023·5 cites·15 claims
- 0287US12105132B2Electric field measuring apparatus and method of measuring electric field using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 1, 2024·1 cites·20 claims
- 0370US2025004028A1Electric field measuring apparatus and method of measuring electric field using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0469US12332298B2Semiconductor test device and system and test method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 0564US12235287B2Substrate processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 25, 2025·0 cites·20 claims
- 0663US2025299934A1Magnetic field generation device for plasma distribution control and operating method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0759US2025171901A1Electrostatic chuck apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0858US2025155473A1Substrate processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0957US2025075323A1Substrate support, thin film processing device, and thin film deposition control method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1056US2025222555A1Polishing control device, polishing control method, and substrate polishing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1155US2025329513A1Inductively-coupled plasma antennas for semiconductor wafer processing systemsSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1254US2024274661A1Dielectric structure and substrate processing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1351US12170233B2Plasma treatment apparatus, a method of monitoring a process of manufacturing a semiconductor device by using the same, and a method of manufacturing a semiconductor device including the monitoring methodSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 17, 2024·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →