Inventor · disambiguated record
Meng-Liang Lin
Also filed as: LIN MENG-LIANG
39 granted patents·39 pending applications·94 citations·filing 2013–2025
96Inventor score
Top patents by PatentIndex Score
78 records- 0198US11527474B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 13, 2022·8 cites·20 claims
- 0298US11380666B2Fan-out package with cavity substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 5, 2022·5 cites·20 claims
- 0396US11075151B2Fan-out package with controllable standoffTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 27, 2021·12 cites·20 claims
- 0496US10790162B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 29, 2020·14 cites·20 claims
- 0595US11908764B2Semiconductor package including a circuit substrate having a cavity and a floor plate embedded in a dielectric material and a semiconductor die disposed in the cavityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·2 cites·20 claims
- 0694US11322447B2Dual-sided routing in 3D SiP structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 3, 2022·3 cites·20 claims
- 0794US11101214B2Package structure with dam structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 24, 2021·8 cites·20 claims
- 0894US9343419B2Bump structures for semiconductor packageTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 17, 2016·21 cites·13 claims
- 0993US11164754B2Fan-out packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 2, 2021·9 cites·20 claims
- 1091US2025349644A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1189US10446522B2Methods of forming multiple conductive features in semiconductor devices in a same formation processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 15, 2019·7 cites·20 claims
- 1287US2025105080A1Manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1386US12444663B2Semiconductor package including a semiconductor die disposed in a cavity and method for manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 14, 2025·0 cites·20 claims
- 1484US12199084B2Fan-out package with cavity substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
- 1584US11362010B2Structure and formation method of chip package with fan-out featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 14, 2022·3 cites·20 claims
- 1683US12205861B2Manufacturing method of semiconductor package including forming cavity in circuit substrate without exposing floor plateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 1783US2025253253A1Dual-sided routing in 3d semiconductor system-in-package structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1882US12308322B2Dual-sided routing in 3D semiconductor system-in-package structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 20, 2025·0 cites·20 claims
- 1982US2025309170A1Package structure with conductive via structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2081US11637054B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 25, 2023·1 cites·20 claims
- 2181US2025357293A1Redistribution structure with copper bumps on planar metal interconnectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2281US2025079428A1Semiconductor Devices and Methods of ManufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2381US2025364337A1Methods of forming packaging substrates including a stress-absorption trenchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2481US2025357304A1Methods of forming an inductor rf isolation structure in an interposerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2580US12354989B2Package structure with conductive via structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 2680US2025364385A1Semiconductor package and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2780US2025357228A1Dam structure for integrated passive device integration and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2880US2025357302A1Method for forming semiconductor package with variable pillar heightTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2979US12300592B2Fan-out package with controllable standoffTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 3079US2024363533A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3178US2025343122A1Embedding barrier layer in fine-pitch bond structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3278US2025343102A1Redistribution structure with warpage tuning layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3377US11901279B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 13, 2024·0 cites·20 claims
- 3477US11855059B2Fan-out package with cavity substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 3577US2025323174A1Interposer structure for semiconductor package including peripheral metal pad around alignment mark and methods of fabricating sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3677US2024178116A1Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3777US2025046722A1Semiconductor package and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3876US12176337B2Semiconductor devices and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 24, 2024·0 cites·20 claims
- 3976US11824007B2Dual-sided routing in 3D SiP structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 21, 2023·0 cites·20 claims
- 4076US2025309088A1Semiconductor package and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4175US10804254B2Fan-out package with cavity substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 13, 2020·1 cites·20 claims
- 4274US11901277B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 4373US11948892B2Formation method of chip package with fan-out featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 2, 2024·0 cites·20 claims
- 4472US12489029B2Redistribution structure with warpage tuning layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 2, 2025·0 cites·20 claims
- 4572US12094819B2Method for forming package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 17, 2024·0 cites·20 claims
- 4672US11854955B2Fan-out package with controllable standoffTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 4771US12368109B2Interposer structure for semiconductor package including peripheral metal pad around alignment mark and methods of fabricating sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 22, 2025·0 cites·20 claims
- 4871US12354938B2Semiconductor package and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 8, 2025·0 cites·20 claims
- 4971US12165980B2Semiconductor package and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 10, 2024·0 cites·20 claims
- 5071US12057424B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 6, 2024·0 cites·20 claims
Showing the top 50 of 78 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →