Inventor · disambiguated record
Mengqi Liu
Also filed as: LIU MENGQI
6 granted patents·2 pending applications·4 citations·filing 2019–2025
68Inventor score
Files withINTEL CORP6NANJING INST OF ENVIRONMENTAL SCIENCES MEE1SK HYNIX NAND PRODUCT SOLUTIONS CORP1
Top patents by PatentIndex Score
8 records- 0179US11678444B2Loading mechanism with integrated heatsinkINTEL CORP·Filed 2019·Granted Jun 13, 2023·4 cites·13 claims
- 0266US2025234478A1Patterned bolster plate and composite back plate for semiconductor chip lga package and cooling assembly retentionINTEL CORP·Filed 2025·Application pending·0 cites
- 0365US12444664B2Loading frame for high I/O count packaged semiconductor chipSK HYNIX NAND PRODUCT SOLUTIONS CORP·Filed 2020·Granted Oct 14, 2025·0 cites·20 claims
- 0463US12279395B2Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retentionINTEL CORP·Filed 2021·Granted Apr 15, 2025·0 cites·14 claims
- 0557US12098982B1Biochemical sludge and physicochemical sludge separate sampling device for identifying attributes of sludgeNANJING INST OF ENVIRONMENTAL SCIENCES MEE·Filed 2023·Granted Sep 24, 2024·0 cites·8 claims
- 0654US12315780B2Technologies for processor loading mechanismsINTEL CORP·Filed 2021·Granted May 27, 2025·0 cites·10 claims
- 0754US12309966B2Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading forceINTEL CORP·Filed 2021·Granted May 20, 2025·0 cites·17 claims
- 0852US2023014898A1Methods and apparatus to improve pin contact of a component stackINTEL CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →