Inventor · disambiguated record
Mei Chin Ng
Also filed as: NG MEI CHIN
8 granted patents·1 pending application·35 citations·filing 2012–2019
83Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0190US9475691B1Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs deviceINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 25, 2016·14 cites·20 claims
- 0286US9219025B1Molded flip-clip semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2014·Granted Dec 22, 2015·12 cites·15 claims
- 0384US10396007B2Semiconductor package with plateable encapsulant and a method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 27, 2019·4 cites·13 claims
- 0474US10431560B2Molded semiconductor package having an optical inspection featureINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 1, 2019·2 cites·21 claims
- 0572US9806043B2Method of manufacturing molded semiconductor packages having an optical inspection featureINFINEON TECHNOLOGIES AG·Filed 2016·Granted Oct 31, 2017·2 cites·13 claims
- 0671US11081417B2Manufacturing a package using plateable encapsulantINFINEON TECHNOLOGIES AG·Filed 2019·Granted Aug 3, 2021·1 cites·17 claims
- 0752US2020006267A1Molded Semiconductor PackageINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
- 0840US10490470B2Semiconductor package and method for fabricating a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2017·Granted Nov 26, 2019·0 cites·11 claims
- 0927US8951841B2Clip frame semiconductor packages and methods of formation thereofNG MELISSA MEI CHING·Filed 2012·Granted Feb 10, 2015·0 cites·30 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →