Inventor · disambiguated record
Meifang Qin
Also filed as: QIN MEIFANG
2 granted patents·1 pending application·86 citations·filing 1999–2003
68Inventor score
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3 records- 0186US6245696B1Lasable bond-ply materials for high density printed wiring boardsHONEYWELL INT INC·Filed 1999·Granted Jun 12, 2001·59 cites·11 claims
- 0281US6673190B2Lasable bond-ply materials for high density printed wiring boardsHONEYWELL INT INC·Filed 2001·Granted Jan 6, 2004·27 cites·9 claims
- 0349US2004170795A1Lasable bond-ply materials for high density printed wiring boardsALLIED SIGNAL INC·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →