Inventor · disambiguated record
Meng-Kai Shih
Also filed as: SHIH MENG-KAI
13 granted patents·8 pending applications·46 citations·filing 2011–2025
89Inventor score
Top patents by PatentIndex Score
21 records- 0193US11742324B2Semiconductor device packages and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Aug 29, 2023·2 cites·12 claims
- 0289US10332862B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jun 25, 2019·6 cites·30 claims
- 0388US10586716B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Mar 10, 2020·7 cites·21 claims
- 0487US8698307B2Semiconductor package with integrated metal pillars and manufacturing methods thereofSHIH MENG-KAI·Filed 2011·Granted Apr 15, 2014·16 cites·20 claims
- 0586US11011496B2Semiconductor device packages and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted May 18, 2021·3 cites·17 claims
- 0685US10770369B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Sep 8, 2020·5 cites·16 claims
- 0784US11375124B2Optical measurement equipment and method for measuring warpage of a workpieceADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jun 28, 2022·4 cites·21 claims
- 0881US12166009B2Semiconductor device packages and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Dec 10, 2024·0 cites·18 claims
- 0975US10985085B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Apr 20, 2021·2 cites·25 claims
- 1070US10861726B2Apparatus and method for measuring warpageADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Dec 8, 2020·1 cites·27 claims
- 1169US2025157947A1Wiring structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 1267US2023011464A1Wiring structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 1361US11164756B2Semiconductor device package having continously formed tapered protrusionsADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Nov 2, 2021·0 cites·18 claims
- 1458US10840219B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Nov 17, 2020·0 cites·19 claims
- 1553US11217502B2Semiconductor device packages and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jan 4, 2022·0 cites·18 claims
- 1652US2020279814A1Wiring structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Application pending·0 cites
- 1751US2019214323A1Filler compositions and underfill compositions and molding compounds including the same for preparing semiconductor packagesADVANCED SEMICONDUCTOR ENG·Filed 2019·Application pending·0 cites
- 1844US2017141007A1Filler compositions and underfill compositions and molding compounds including the same for preparing semiconductor packagesADVANCED SEMICONDUCTOR ENG·Filed 2015·Application pending·0 cites
- 1941US2014138421A1Separation apparatuses and methods for separating glass sheets from glass ribbonsCORNING INC·Filed 2013·Application pending·0 cites
- 2040US2020381345A1Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Application pending·0 cites
- 2137US2020381338A1Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →