Inventor · disambiguated record

Meng-Huang Sie

Also filed as: SIE MENG-HUANG

0 granted patents·2 pending applications·0 citations·filing 2023–2024

Technology areasH10W

Files withKORE SEMICONDUCTOR CO LTD1 NXP BV1

Top patents by PatentIndex Score

2 records

0153US2025096077A1Semiconductor device with enhanced solderability and method thereforNXP BV·Filed 2023·Application pending·0 cites
0242US2025096192A1Package structure and fabricating method thereofKORE SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →