Inventor · disambiguated record
Meng-Hsien Tsai
Also filed as: TSAI MENG-HSIEN
1 granted patent·3 pending applications·0 citations·filing 2019–2024
10Inventor score
Files withWINBOND ELECTRONICS CORP4
Top patents by PatentIndex Score
4 records- 0155US2025324587A1Semiconductor structure and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0249US2025089245A1Semiconductor structure and methods for forming the sameWINBOND ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 0346US2024231245A9Semiconductor wafer, processing apparatus for overlay shift and processing method thereofWINBOND ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 0441US11152270B2Monitoring structure for critical dimension of lithography processWINBOND ELECTRONICS CORP·Filed 2019·Granted Oct 19, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →