Inventor · disambiguated record
Meng-Hsun Wan
Also filed as: WAN MENG · WAN MENG-HSUN
23 granted patents·360 citations·filing 2012–2023
95Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD12TAIWAN SEMICONDUCTOR MFG7WAN MENG-HSUN2CHEN SZU-YING1CRRC CHANGZHOU TECH MARK IND CO LTD1
Top patents by PatentIndex Score
23 records- 0198US9337235B2Method and apparatus for image sensor packagingTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted May 10, 2016·227 cites·20 claims
- 0296US8957358B2CMOS image sensor chips with stacked scheme and methods for forming the sameWAN MENG-HSUN·Filed 2012·Granted Feb 17, 2015·37 cites·20 claims
- 0396US8878325B2Elevated photodiode with a stacked schemeTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Nov 4, 2014·12 cites·20 claims
- 0495US9257414B2Stacked semiconductor structure and methodTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 9, 2016·14 cites·20 claims
- 0594US10090349B2CMOS image sensor chips with stacked scheme and methods for forming the sameWAN MENG HSUN·Filed 2012·Granted Oct 2, 2018·18 cites·20 claims
- 0693US9153565B2Image sensors with a high fill-factorCHEN SZU-YING·Filed 2012·Granted Oct 6, 2015·14 cites·20 claims
- 0792US10157889B2Stacked semiconductor structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·5 cites·20 claims
- 0891US9123617B2Elevated photodiode with a stacked schemeTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Sep 1, 2015·4 cites·20 claims
- 0990US8946784B2Method and apparatus for image sensor packagingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 3, 2015·8 cites·20 claims
- 1089US9530811B2Elevated photodiode with a stacked schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 27, 2016·4 cites·20 claims
- 1189US9443836B2Forming pixel units of image sensors through bonding two chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 13, 2016·8 cites·20 claims
- 1288US8933527B2Elevated photodiodes with crosstalk isolationTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jan 13, 2015·5 cites·19 claims
- 1383US12068287B2Stacked semiconductor structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 20, 2024·0 cites·20 claims
- 1483US10062721B2Elevated photodiode with a stacked schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 28, 2018·2 cites·20 claims
- 1579US10475843B2Method and apparatus for image sensor packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 12, 2019·2 cites·20 claims
- 1676US11587910B2Stacked semiconductor structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 21, 2023·0 cites·20 claims
- 1771US9368545B2Elevated photodiodes with crosstalk isolationTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 14, 2016·0 cites·19 claims
- 1867US11037909B2Stacked semiconductor structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 15, 2021·0 cites·20 claims
- 1965US10510730B2Stacked semiconductor structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·0 cites·20 claims
- 2064US10930699B2Method and apparatus for image sensor packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 23, 2021·0 cites·20 claims
- 2163US10510791B2Elevated photodiode with a stacked schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·0 cites·20 claims
- 2258US9716078B2Stacked semicondcutor structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 25, 2017·0 cites·20 claims
- 2337US12454251B2End cover assembly, air cylinder, tread cleaner and railway vehicleCRRC CHANGZHOU TECH MARK IND CO LTD·Filed 2020·Granted Oct 28, 2025·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →