Inventor · disambiguated record

Mei Yong Wang

Also filed as: Wang mei yong

2 granted patents·1 pending application·1 citations·filing 2019–2025

32Inventor score

Technology areasH10W

Files withINFINEON TECHNOLOGIES AG3

Top patents by PatentIndex Score

3 records

0164US2025266311A1Methods for Manufacturing Semiconductor PackagesINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
0259US12300559B2Semiconductor packages and methods for manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2021·Granted May 13, 2025·0 cites·15 claims
0357US11217511B2Quad package with conductive clips connected to terminals at upper surface of semiconductor dieINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jan 4, 2022·1 cites·27 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →