Inventor · disambiguated record
Mitsunori Abe
Also filed as: ABE MITSUNORI
15 granted patents·4 pending applications·82 citations·filing 1997–2022
87Inventor score
Top patents by PatentIndex Score
19 records- 0187US5910755ALaminate circuit board with selectable connections between wiring layersFUJITSU LTD·Filed 1997·Granted Jun 8, 1999·71 cites·5 claims
- 0277US11066206B2Package, and methods for producing and for using self-adhesiveZEON CORP·Filed 2019·Granted Jul 20, 2021·0 cites·10 claims
- 0377US10863629B2Method of manufacturing through hole of substrateFUJITSU LTD·Filed 2019·Granted Dec 8, 2020·2 cites·5 claims
- 0471US8338715B2PCB with soldering pad projections forming fillet solder joints and method of production thereofHIRANO YOSHIKAZU·Filed 2008·Granted Dec 25, 2012·7 cites·7 claims
- 0563US9591763B2Substrate with embedded componentFUJITSU LTD·Filed 2016·Granted Mar 7, 2017·1 cites·9 claims
- 0656US12303829B2Detoxification device and inlet nozzleEDWARDS JAPAN LTD·Filed 2019·Granted May 20, 2025·0 cites·4 claims
- 0754US10624216B2Wiring board, electronic apparatus, method for attaching sheet metal covers, and method for manufacturing wiring boardFUJITSU LTD·Filed 2018·Granted Apr 14, 2020·0 cites·13 claims
- 0854US8525042B2Printed circuit board and printed circuit board unitABE MITSUNORI·Filed 2010·Granted Sep 3, 2013·1 cites·15 claims
- 0954US2018148214A1Package, and methods for producing and for using self-adhesiveZEON CORP·Filed 2016·Application pending·0 cites
- 1051US10929585B2Recording medium recording via lifetime calculation program, via lifetime calculation method, and information processing deviceFUJITSU LTD·Filed 2019·Granted Feb 23, 2021·0 cites·20 claims
- 1151US10882988B2Vinyl chloride resin composition, vinyl chloride resin molded product, and laminateZEON CORP·Filed 2018·Granted Jan 5, 2021·0 cites·8 claims
- 1248US11435385B2Specific conductivity measurement method, recording medium recording specific conductivity calculation program, and specific conductivity measurement systemFUJITSU LTD·Filed 2020·Granted Sep 6, 2022·0 cites·5 claims
- 1347US10783309B2Method for outputting impact degree and information processing deviceFUJITSU LTD·Filed 2019·Granted Sep 22, 2020·0 cites·15 claims
- 1447US10342129B2Substrate and method of manufacturing the sameFUJITSU LTD·Filed 2018·Granted Jul 2, 2019·0 cites·4 claims
- 1546US2024191845A1Gas treatment systemEDWARDS JAPAN LTD·Filed 2022·Application pending·0 cites
- 1645US10393797B2Inspection method of laminated board, inspection module, and palletFUJITSU LTD·Filed 2017·Granted Aug 27, 2019·0 cites·12 claims
- 1743US8701488B2Electronic component analyzing apparatus and methodHIRANO YOSHIKAZU·Filed 2011·Granted Apr 22, 2014·0 cites·18 claims
- 1838US2003081877A1Optical circuit and manufacturing method of the sameFUJITSU LTD·Filed 2002·Application pending·0 cites
- 1937US2017196077A1Rigid flexible board and method for manufacturing the sameFUJITSU LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →