Inventor · disambiguated record
Micah David Armstrong
Also filed as: ARMSTRONG MICAH · ARMSTRONG MICAH DAVID
0 granted patents·3 pending applications·0 citations·filing 2023–2024
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0157US2025279346A1High aspect ratio vias with low stress in integrated circuit packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 0255US2025006646A1Through glass vias with compliant layer for integrated circuit device packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 0351US2025006614A1Intervening layers for thru-via seed metallizationSHANMUGAM RENGARAJAN·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →