Inventor · disambiguated record
Min Jun Bae
Also filed as: BAE MIN JUN
4 granted patents·3 pending applications·5 citations·filing 2019–2025
62Inventor score
Top patents by PatentIndex Score
7 records- 0189US11373980B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 28, 2022·3 cites·20 claims
- 0286US11652090B2Semiconductor package and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 16, 2023·2 cites·20 claims
- 0362US11967549B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 23, 2024·0 cites·20 claims
- 0453US11177205B2Semiconductor package having multi-level and multi-directional shape narrowing viasSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 16, 2021·0 cites·11 claims
- 0553US2024014163A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0651US2023068587A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0744US2025375280A1Interdental papilla reconstruction method using hyaluronic acidNOVABIO CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →