Inventor · disambiguated record
Michael B. Ball
Also filed as: BALL MICHAEL · BALL MICHAEL B · BALL MICHAEL BRYAN
107 granted patents·1 pending application·4,809 citations·filing 1994–2006
99Inventor score
Files withMICRON TECHNOLOGY INC107
Top patents by PatentIndex Score
108 records- 0199US6407456B1Multi-chip device utilizing a flip chip and wire bond assemblyMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 18, 2002·346 cites·15 claims
- 0299US5917242ACombination of semiconductor interconnectMICRON TECHNOLOGY INC·Filed 1996·Granted Jun 29, 1999·290 cites·25 claims
- 0398US6080264ACombination of semiconductor interconnectMICRON TECHNOLOGY INC·Filed 1997·Granted Jun 27, 2000·199 cites·16 claims
- 0498US5689135AMulti-chip device and method of fabrication employing leads over and under processesMICRON TECHNOLOGY INC·Filed 1995·Granted Nov 18, 1997·274 cites·21 claims
- 0597US6989285B2Method of fabrication of stacked semiconductor devicesMICRON TECHNOLOGY INC·Filed 2004·Granted Jan 24, 2006·115 cites·19 claims
- 0697US6784023B2Method of fabrication of stacked semiconductor devicesMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 31, 2004·110 cites·10 claims
- 0797US6051886AAngularly offset stacked die multichip device and method of manufactureMICRON TECHNOLOGY INC·Filed 1998·Granted Apr 18, 2000·222 cites·6 claims
- 0897USRE36613EMulti-chip stacked devicesMICRON TECHNOLOGY INC·Filed 1996·Granted Mar 14, 2000·265 cites·3 claims
- 0997US5952725AStacked semiconductor devicesMICRON TECHNOLOGY INC·Filed 1997·Granted Sep 14, 1999·195 cites·8 claims
- 1095US6533159B1Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in fluxMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 18, 2003·62 cites·15 claims
- 1194US6572444B1Apparatus and methods of automated wafer-grinding using grinding surface position monitoringMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 3, 2003·56 cites·31 claims
- 1294US6165815AMethod of fabrication of stacked semiconductor devicesMICRON TECHNOLOGY INC·Filed 1997·Granted Dec 26, 2000·124 cites·27 claims
- 1394US6097098ADie interconnections using intermediate connection elements secured to the die faceMICRON TECHNOLOGY INC·Filed 1997·Granted Aug 1, 2000·131 cites·49 claims
- 1494US5721452AAngularly offset stacked die multichip device and method of manufactureMICRON TECHNOLOGY INC·Filed 1995·Granted Feb 24, 1998·150 cites·6 claims
- 1593US6861345B2Method of disposing conductive bumps onto a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 1, 2005·57 cites·24 claims
- 1693US6268275B1Method of locating conductive spheres utilizing screen and hopper of solder ballsMICRON TECHNOLOGY INC·Filed 1998·Granted Jul 31, 2001·62 cites·10 claims
- 1792US6563205B1Angularly offset and recessed stacked die multichip device and method of manufactureMICRON TECHNOLOGY INC·Filed 1999·Granted May 13, 2003·115 cites·25 claims
- 1892US5874781AAngularly offset stacked die multichip device and method of manufactureMICRON TECHNOLOGY INC·Filed 1996·Granted Feb 23, 1999·114 cites·12 claims
- 1991US6630372B2Method for routing die interconnections using intermediate connection elements secured to the die faceMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 7, 2003·50 cites·10 claims
- 2091US5886412AAngularly offset and recessed stacked die multichip deviceMICRON TECHNOLOGY INC·Filed 1997·Granted Mar 23, 1999·113 cites·6 claims
- 2190US6337227B1Method of fabrication of stacked semiconductor devicesMICRON TECHNOLOGY INC·Filed 2000·Granted Jan 8, 2002·38 cites·27 claims
- 2290US5963794AAngularly offset stacked die multichip device and method of manufactureMICRON TECHNOLOGY INC·Filed 1998·Granted Oct 5, 1999·102 cites·25 claims
- 2389US5890644AApparatus and method of clamping semiconductor devices using sliding finger supportsMICRON TECHNOLOGY INC·Filed 1996·Granted Apr 6, 1999·55 cites·31 claims
- 2489US5647528ABondhead lead clamp apparatus and methodMICRON TECHNOLOGY INC·Filed 1996·Granted Jul 15, 1997·60 cites·57 claims
- 2588US6279976B1Wafer handling device having conforming perimeter sealMICRON TECHNOLOGY INC·Filed 1999·Granted Aug 28, 2001·88 cites·47 claims
- 2687US6420256B1Method of improving interconnect of semiconductor devices by using a flattened ball bondMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 16, 2002·33 cites·4 claims
- 2787US6068174ADevice and method for clamping and wire-bonding the leads of a lead frame one set at a timeMICRON TECHNOLOGY INC·Filed 1996·Granted May 30, 2000·56 cites·6 claims
- 2887US5673845ALead penetrating clamping systemMICRON TECHNOLOGY INC·Filed 1996·Granted Oct 7, 1997·51 cites·132 claims
- 2985US6426564B1Recessed tape and method for forming a BGA assemblyMICRON TECHNOLOGY INC·Filed 1999·Granted Jul 30, 2002·55 cites·43 claims
- 3085US6380635B1Apparatus and methods for coupling conductive leads of semiconductor assembliesMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 30, 2002·29 cites·53 claims
- 3184US6624059B2Method of improving interconnect of semiconductor devices by utilizing a flattened ball bondMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 23, 2003·25 cites·4 claims
- 3284US6551917B2Method of locating conductive spheres utilizing screen and hopper of solder ballsMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 22, 2003·22 cites·10 claims
- 3384US6186392B1Method and system for forming contacts on a semiconductor component by aligning and attaching ferromagnetic ballsMICRON TECHNOLOGY INC·Filed 2000·Granted Feb 13, 2001·39 cites·31 claims
- 3484US6169331B1Apparatus for electrically coupling bond pads of a microelectronic deviceMICRON TECHNOLOGY INC·Filed 1998·Granted Jan 2, 2001·53 cites·79 claims
- 3584US5898220AMulti-chip device and method of fabrication employing leads over and under processesMICRON TECHNOLOGY INC·Filed 1997·Granted Apr 27, 1999·67 cites·19 claims
- 3683US6047877ALead penetrating clamping systemMICRON TECHNOLOGY INC·Filed 1997·Granted Apr 11, 2000·38 cites·14 claims
- 3783US5954842ALead finger clamp assemblyMICRON TECHNOLOGY INC·Filed 1996·Granted Sep 21, 1999·60 cites·25 claims
- 3882US7371612B2Method of fabrication of stacked semiconductor devicesMICRON TECHNOLOGY INC·Filed 2006·Granted May 13, 2008·8 cites·18 claims
- 3982US6949158B2Using backgrind wafer tape to enable wafer mounting of bumped wafersMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 27, 2005·24 cites·53 claims
- 4082US6283358B1System for forming contacts on a semiconductor component by aligning and attaching ferromagnetic ballsMICRON TECHNOLOGY INC·Filed 2000·Granted Sep 4, 2001·32 cites·28 claims
- 4182US5801448AConductive lines on the back side of wafers and dice for semiconductor interconnectsMICRON TECHNOLOGY INC·Filed 1997·Granted Sep 1, 1998·56 cites·19 claims
- 4281US6000599ABondhead lead clamp apparatus and methodMICRON TECHNOLOGY INC·Filed 1997·Granted Dec 14, 1999·34 cites·19 claims
- 4381US5817530AUse of conductive lines on the back side of wafers and dice for semiconductor interconnectsMICRON TECHNOLOGY INC·Filed 1996·Granted Oct 6, 1998·54 cites·13 claims
- 4479US7166495B2Method of fabricating a multi-die semiconductor package assemblyMICRON TECHNOLOGY INC·Filed 1996·Granted Jan 23, 2007·46 cites·11 claims
- 4579US6602778B2Apparatus and methods for coupling conductive leads of semiconductor assembliesMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 5, 2003·19 cites·27 claims
- 4679US6595408B1Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux prior to placementMICRON TECHNOLOGY INC·Filed 1998·Granted Jul 22, 2003·30 cites·70 claims
- 4777US6334566B1Device and method for clamping and wire-bonding the leads of a lead frame one set at a timeMICRON TECHNOLOGY INC·Filed 2000·Granted Jan 1, 2002·15 cites·1 claims
- 4877US5976964AMethod of improving interconnect of semiconductor device by utilizing a flattened ball bondMICRON TECHNOLOGY INC·Filed 1997·Granted Nov 2, 1999·34 cites·9 claims
- 4976US6715659B2Apparatus for clamping semiconductor devices using sliding finger supportsMICRON TECHNOLOGY INC·Filed 2002·Granted Apr 6, 2004·12 cites·21 claims
- 5076US6478211B2Device and method for clamping and wire-bonding the leads of a lead frame one set at a timeMICRON TECHNOLOGY INC·Filed 2001·Granted Nov 12, 2002·13 cites·28 claims
Showing the top 50 of 108 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →