Inventor · disambiguated record
Michael H. Bunyan
Also filed as: BUNYAN MICHAEL · BUNYAN MICHAEL H
30 granted patents·10 pending applications·1,354 citations·filing 1995–2018
98Inventor score
Top patents by PatentIndex Score
40 records- 0197US8766108B2Encapsulated expanded crimped metal mesh for sealing and EMI shielding applicationsBUNYAN MICHAEL H·Filed 2011·Granted Jul 1, 2014·30 cites·25 claims
- 0297US6410137B1Intumescent, flame retardant pressure sensitive adhesive composition for EMI shielding applicationsPARKER HANNIFIN CORP·Filed 1999·Granted Jun 25, 2002·135 cites·27 claims
- 0396US6054198AConformal thermal interface material for electronic componentsPARKER HANNIFIN CORP·Filed 1997·Granted Apr 25, 2000·230 cites·19 claims
- 0495US7147041B2Lightweight heat sinkPARKER HANNIFIN CORP·Filed 2005·Granted Dec 12, 2006·47 cites·35 claims
- 0594US6432497B2Double-side thermally conductive adhesive tape for plastic-packaged electronic componentsPARKER HANNIFIN CORP·Filed 1998·Granted Aug 13, 2002·178 cites·12 claims
- 0693US8759692B2Encapsulated expanded crimped metal mesh for sealing, EMI shielding and lightning strike applicationsBUNYAN MICHAEL H·Filed 2012·Granted Jun 24, 2014·21 cites·10 claims
- 0793US6331349B1Form-in-place EMI gasketsPARKER HANNIFIN CORP·Filed 2000·Granted Dec 18, 2001·36 cites·7 claims
- 0892US6096413AForm-in-place EMI gasketsCHOMERICS INC·Filed 1997·Granted Aug 1, 2000·61 cites·6 claims
- 0991US6835453B2Clean release, phase change thermal interfacePARKER HANNIFIN CORP·Filed 2002·Granted Dec 28, 2004·128 cites·72 claims
- 1089US6946190B2Thermal management materialsPARKER HANNIFIN CORP·Filed 2003·Granted Sep 20, 2005·57 cites·28 claims
- 1187US8633402B2Low force deflection and corrosion resistant EMI gasketBUNYAN MICHAEL H·Filed 2011·Granted Jan 21, 2014·8 cites·10 claims
- 1287US7208192B2Thermally or electrically-conductive form-in-place gap filterPARKER HANNIFIN CORP·Filed 2003·Granted Apr 24, 2007·48 cites·17 claims
- 1387US5641438AMethod for forming an EMI shielding gasketFiled 1995·Granted Jun 24, 1997·60 cites·14 claims
- 1485US6956739B2High temperature stable thermal interface materialPARKER HANNIFIN CORP·Filed 2003·Granted Oct 18, 2005·40 cites·52 claims
- 1584US6635354B2Form-in place EMI gasketsPARKER HANNIFIN CORP·Filed 2001·Granted Oct 21, 2003·30 cites·11 claims
- 1683US7682690B2Thermal management materials having a phase change dispersionPARKER HANNIFIN CORP·Filed 2002·Granted Mar 23, 2010·37 cites·24 claims
- 1781US6303180B1Form-in-place EMI gasketsPARKER HANNIFIN CORP·Filed 1997·Granted Oct 16, 2001·48 cites·28 claims
- 1881US6248393B1Flame retardant EMI shielding materials and method of manufacturePARKER HANNIFIN CORP·Filed 1999·Granted Jun 19, 2001·31 cites·9 claims
- 1980US6777095B2Flame retardant EMI shielding gasketPARKER HANNIFIN CORP·Filed 2004·Granted Aug 17, 2004·18 cites·10 claims
- 2080US6521348B2Flame retardant EMI shielding gasketPARKER HANNIFIN CORP·Filed 2002·Granted Feb 18, 2003·18 cites·18 claims
- 2179US8119191B2Dispensable cured resinBUNYAN MICHAEL H·Filed 2007·Granted Feb 21, 2012·14 cites·15 claims
- 2276US6387523B2Flame retardant EMI shielding gasketPARKER HANNIFIN CORP·Filed 2001·Granted May 14, 2002·14 cites·8 claims
- 2373US7897264B2Reactive foil assemblyPARKER HANNIFIN CORP·Filed 2007·Granted Mar 1, 2011·5 cites·28 claims
- 2470US9635790B2Deflectable conductive gasket with environmental sealPARKER HANNIFIN CORP·Filed 2013·Granted Apr 25, 2017·2 cites·9 claims
- 2568US6716536B2Flame retardant EMI shielding gasketPARKER HANNIFIN CORP·Filed 2002·Granted Apr 6, 2004·9 cites·9 claims
- 2667USRE41576EConformal thermal interface material for electronic componentsPARKER HANNIFIN CORP·Filed 2000·Granted Aug 24, 2010·16 cites·19 claims
- 2761US6056527AApparatus for forming a gasketFiled 1997·Granted May 2, 2000·24 cites·14 claims
- 2858US7141155B2Polishing article for electro-chemical mechanical polishingPARKER HANNIFIN CORP·Filed 2004·Granted Nov 28, 2006·6 cites·13 claims
- 2956US8923961B2Electrode assembly for delivering a therapeutic agent into ocular tissueSINGH RISHI P·Filed 2011·Granted Dec 30, 2014·3 cites·10 claims
- 3049US2015382479A1Pre-applied conductive adhesive for emi shieldingPARKER HANNIFIN CORP·Filed 2014·Application pending·0 cites
- 3148US2007052125A1Form-in-place EMI gasketsKALINOSKI JOHN P·Filed 2006·Application pending·0 cites
- 3246US2011308781A1Thermally conductive gel packsO'RIORDAN EOIN·Filed 2009·Application pending·0 cites
- 3345US10886193B2Thermal interface materialPARKER HANNIFIN CORP·Filed 2017·Granted Jan 5, 2021·0 cites·15 claims
- 3445US2011162879A1Electrically-conductive foam emi shieldPARKER HANNIFIN CORP·Filed 2009·Application pending·0 cites
- 3545US2006263570A1Thermal lamination moduleBUNYAN MICHAEL H·Filed 2006·Application pending·0 cites
- 3642US2002076547A1Form-in-place EMI gasketsFiled 2001·Application pending·0 cites
- 3738US2018344515A1Thermoregulatory glove and method for producing a convergence in body temperaturePARKER HANNIFIN CORP·Filed 2018·Application pending·0 cites
- 3834US2003207064A1Conformal thermal interface material for electronic componentsFiled 2003·Application pending·0 cites
- 3931US2008012103A1Emi absorbing gap filling materialFOSTER ROBERT H·Filed 2007·Application pending·0 cites
- 4031US2012133072A1Fully-cured thermally or electrically conductive form-in-place gap fillerBUNYAN MICHAEL H·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →