Inventor · disambiguated record

Minchun Cai

Also filed as: CAI MINCHUN

1 granted patent·1 pending application·0 citations·filing 2020–2020

2Inventor score

Technology areasH10P H10W

Files withSHANGHAI HUALI INTEGRATED CIRCUIT CORP2

Top patents by PatentIndex Score

2 records

0140US11728213B2Method of copper plating fillingSHANGHAI HUALI INTEGRATED CIRCUIT CORP·Filed 2020·Granted Aug 15, 2023·0 cites·17 claims
0224US2021028139A1Method for Monitoring Generation of a Nickel Metal SilicideSHANGHAI HUALI INTEGRATED CIRCUIT CORP·Filed 2020·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →