Inventor · disambiguated record
Ming-Hong Cha
Also filed as: CHA MING-HONG
7 granted patents·1 pending application·32 citations·filing 2012–2024
83Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0194US8829673B2Bonded structures for package and substrateTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Sep 9, 2014·17 cites·20 claims
- 0289US11075173B2Semiconductor device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 27, 2021·5 cites·20 claims
- 0386US9397059B2Bonded structures for package and substrateTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jul 19, 2016·4 cites·20 claims
- 0483US9673161B2Bonded structures for package and substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 6, 2017·3 cites·20 claims
- 0577US2024379584A1Semiconductor device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0675US11088102B2Bonded structures for package and substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·1 cites·20 claims
- 0771US10468366B2Bonded structures for package and substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 5, 2019·1 cites·20 claims
- 0866US9123788B2Bonded structures for package and substrateTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Sep 1, 2015·1 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →