Inventor · disambiguated record
Mingchih Chen
Also filed as: CHEN MINGCHIH
4 granted patents·0 citations·filing 2021–2022
54Inventor score
Technology areasH10W
Files withSJ SEMICONDUCTOR JIANGYIN CORP4
Top patents by PatentIndex Score
4 records- 0165US11842976B2Semiconductor package structure with heat sink and method preparing the sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2022·Granted Dec 12, 2023·0 cites·5 claims
- 0257US11488925B2Semiconductor package structure with heat sink and method preparing the sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2021·Granted Nov 1, 2022·0 cites·9 claims
- 0354US12482759B2Wafer-level ASIC 3D integrated substrate, packaging device and preparation methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2022·Granted Nov 25, 2025·0 cites·5 claims
- 0452US12512411B2Wafer-level ASIC 3D integrated substrate, packaging device and preparation methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2022·Granted Dec 30, 2025·0 cites·4 claims
Join the waitlist — get patent alerts
Get an alert when Mingchih Chen files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →