Inventor · disambiguated record
Min-Yao Chen
Also filed as: CHEN MIN-YAO
8 granted patents·20 pending applications·12 citations·filing 2010–2025
79Inventor score
Top patents by PatentIndex Score
28 records- 0192US11239184B2Package substrate, electronic device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Feb 1, 2022·3 cites·20 claims
- 0291US11342272B2Substrate structures, and methods for forming the same and semiconductor package structuresADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted May 24, 2022·4 cites·12 claims
- 0374US8510940B2Method of fabricating a multi-trace via substrateCHEN MIN-YAO·Filed 2010·Granted Aug 20, 2013·5 cites·19 claims
- 0470US11997798B2Package substrate and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted May 28, 2024·0 cites·19 claims
- 0568US12315828B2Package substrate, electronic device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted May 27, 2025·0 cites·18 claims
- 0663US11432406B2Package substrateADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Aug 30, 2022·0 cites·19 claims
- 0762US12494437B2Substrate structure including different size of electronic componentADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Dec 9, 2025·0 cites·6 claims
- 0857US2025159800A1Package substrate and manufacturing method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 0956US2024282590A1Package substrate and fabricating method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 1056US2024243048A1Electronic package, package substrate and manufacturing method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 1155US2024213137A1Package substrate and fabricating method thereofAALTOSEMI INC·Filed 2023·Application pending·0 cites
- 1253US2025014989A1Package substrate and fabricating method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 1352US2024096721A1Electronic package and manufacturing method thereofAALTOSEMI INC·Filed 2023·Application pending·0 cites
- 1452US2025096105A1Package substrate and fabricating method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 1552US2024282683A1Electronic package, package substrate and manufacturing method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 1652US2023282556A1Substrate structureAALTOSEMI INC·Filed 2023·Application pending·0 cites
- 1752US2025192014A1Electronic package and manufacturing method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 1851US2023290744A1Electronic package, package substrate and manufacturing method thereofAALTOSEMI INC·Filed 2023·Application pending·0 cites
- 1950US11335650B2Package substrate, electronic device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted May 17, 2022·0 cites·20 claims
- 2050US2025323062A1Fabricating method of package substrateAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 2150US2024096776A1Package substrateAALTOSEMI INC·Filed 2023·Application pending·0 cites
- 2248US2023298986A1Package substrate and manufacturing method thereofAALTOSEMI INC·Filed 2023·Application pending·0 cites
- 2346US2025308935A1Method for fabricating a package substrateAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 2446US2025372400A1Fabricating method of package substrateAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 2544US2025308937A1Manufacturing method of package substrateAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 2643US2025300052A1Semiconductor package and fabricating method thereofAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 2742US2025246443A1Package substrate and manufacturing method thereofAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 2839US2025253261A1Electronic package and manufacturing method thereofAALTOSEMI INC·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →