Inventor · disambiguated record
Min-Han Chuang
Also filed as: CHUANG MIN-HAN
16 granted patents·6 pending applications·23 citations·filing 2012–2025
89Inventor score
Top patents by PatentIndex Score
22 records- 0196US12068211B2Electronic package comprising multiple wires inside an electronic componentSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Aug 20, 2024·4 cites·9 claims
- 0296US12014967B2Manufacturing method of electronic package comprising a wire within an electronic componentSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Jun 18, 2024·4 cites·10 claims
- 0396US11728234B2Electronic package comprising wire inside an electronic component and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Aug 15, 2023·6 cites·9 claims
- 0493US12368081B2Electronic package comprising conductive layer connected electrode pad through electronic componentSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Granted Jul 22, 2025·1 cites·11 claims
- 0586US12293952B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Granted May 6, 2025·0 cites·10 claims
- 0686US2024379477A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0782US12100633B2Electronic package comprising wire inside an electronic componentSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Sep 24, 2024·0 cites·14 claims
- 0876US9196941B2Cross-coupled bandpass filterCHUANG MIN-HAN·Filed 2012·Granted Nov 24, 2015·6 cites·6 claims
- 0974US12100648B2Electronic module, manufacturing method thereof and electronic package having the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Sep 24, 2024·0 cites·9 claims
- 1072US12500145B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Dec 16, 2025·0 cites·20 claims
- 1171US2025285952A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2025·Application pending·0 cites
- 1270US12334425B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Jun 17, 2025·0 cites·20 claims
- 1366US11776897B2Electronic module, manufacturing method thereof and electronic package having the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Oct 3, 2023·0 cites·16 claims
- 1461US2025300047A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 1556US9281557B2Multi bandwidth balun and circuit structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Mar 8, 2016·1 cites·30 claims
- 1655US9054670B2Cross-coupled bandpass filterCHUANG MIN-HAN·Filed 2012·Granted Jun 9, 2015·1 cites·6 claims
- 1749US12027753B2Electronic package and antenna structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Jul 2, 2024·0 cites·20 claims
- 1849US9698090B2Semiconductor substrate and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Jul 4, 2017·0 cites·8 claims
- 1945US2017271251A1Fabrication method of semiconductor substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
- 2041US2014184261A1Testing apparatus and testing methodSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 2139US9503043B2Duplexer, circuit structure thereof and RF transceiver apparatus comprising the duplexerSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Nov 22, 2016·0 cites·29 claims
- 2237US2015188510A1Circuit structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →