Inventor · disambiguated record
Michael W. Devre
Also filed as: DEVRE MICHAEL W · DEVRE MICHAEL WAYNE
6 granted patents·582 citations·filing 1994–1998
87Inventor score
Top patents by PatentIndex Score
6 records- 0197US5532512ADirect stacked and flip chip power semiconductor device structuresGEN ELECTRIC·Filed 1994·Granted Jul 2, 1996·377 cites·22 claims
- 0288US5576925AFlexible multilayer thin film capacitorsGEN ELECTRIC·Filed 1994·Granted Nov 19, 1996·72 cites·18 claims
- 0385US6071822AEtching process for producing substantially undercut free silicon on insulator structuresPLASMA THERM INC·Filed 1998·Granted Jun 6, 2000·93 cites·27 claims
- 0463US5431963AMethod for adhering diamondlike carbon to a substrateGEN ELECTRIC·Filed 1994·Granted Jul 11, 1995·23 cites·6 claims
- 0542US5569487ACapacitor dielectrics of silicon-doped amorphous hydrogenated carbonGEN ELECTRIC·Filed 1995·Granted Oct 29, 1996·11 cites·11 claims
- 0637US5643637AMethod of grading the electric field of an electrodeGEN ELECTRIC·Filed 1995·Granted Jul 1, 1997·6 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →