Inventor · disambiguated record
Mitsuaki Fusumada
Also filed as: FUSUMADA MITSUAKI
6 granted patents·4 pending applications·39 citations·filing 2002–2015
78Inventor score
Top patents by PatentIndex Score
10 records- 0182US6617046B2Thermosetting resin composition and semiconductor device using the sameNITTO DENKO CORP·Filed 2002·Granted Sep 9, 2003·29 cites·9 claims
- 0269US9796828B2Epoxy resin composition and electronic component deviceHITACHI CHEMICAL CO LTD·Filed 2013·Granted Oct 24, 2017·1 cites·12 claims
- 0365US8298872B2Manufacturing method for semiconductor deviceODA TAKASHI·Filed 2010·Granted Oct 30, 2012·2 cites·8 claims
- 0463US8729715B2Epoxy resin composition for semiconductor encapsulationIWASHIGE TOMOHITO·Filed 2012·Granted May 20, 2014·2 cites·6 claims
- 0561US10301509B2Sheet for thermal bonding and sheet for thermal bonding with affixed dicing tapeNITTO DENKO CORP·Filed 2015·Granted May 28, 2019·1 cites·3 claims
- 0652US2009281225A1Epoxy resin composition for semiconductor encapsulation and semiconductor device using the sameNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 0748US6916538B2Thermosetting resin composition and semiconductor device obtained with the sameNITTO DENKO CORP·Filed 2003·Granted Jul 12, 2005·4 cites·24 claims
- 0835US2012153512A1Epoxy resin composition for semiconductor encapsulation and semiconductor device obtained using the sameSUGIMOTO NAOYA·Filed 2011·Application pending·0 cites
- 0935US2012115281A1Method of manufacturing semiconductor deviceIWASHIGE TOMOHITO·Filed 2011·Application pending·0 cites
- 1033US2013148304A1Epoxy resin composition for electronic parts encapsulation and electronic parts-equipped device using the sameKITAGAWA YUYA·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →