Inventor · disambiguated record
Michael A. Gaynes
Also filed as: GAYNES MICHAEL A
23 granted patents·3 pending applications·215 citations·filing 2003–2019
95Inventor score
Top patents by PatentIndex Score
26 records- 0198US8493738B2Cooled electronic system with thermal spreaders coupling electronics cards to cold railsCHAINER TIMOTHY J·Filed 2011·Granted Jul 23, 2013·75 cites·13 claims
- 0297US9881880B2Tamper-proof electronic packages with stressed glass component substrate(s)IBM·Filed 2016·Granted Jan 30, 2018·15 cites·13 claims
- 0396US9913370B2Tamper-proof electronic packages formed with stressed glassIBM·Filed 2016·Granted Mar 6, 2018·14 cites·18 claims
- 0496US8649177B2Method of fabricating a cooled electronic systemCHAINER TIMOTHY J·Filed 2012·Granted Feb 11, 2014·28 cites·11 claims
- 0595US9999124B2Tamper-respondent assemblies with trace regions of increased susceptibility to breakingIBM·Filed 2016·Granted Jun 12, 2018·15 cites·20 claims
- 0689US10177102B2Tamper-proof electronic packages with stressed glass component substrate(s)IBM·Filed 2017·Granted Jan 8, 2019·4 cites·7 claims
- 0787US7079393B2Fluidic cooling systems and methods for electronic componentsIBM·Filed 2004·Granted Jul 18, 2006·44 cites·21 claims
- 0886US9330946B1Method and structure of die stacking using pre-applied underfillIBM·Filed 2015·Granted May 3, 2016·5 cites·21 claims
- 0984US10257924B2Tamper-proof electronic packages formed with stressed glassIBM·Filed 2017·Granted Apr 9, 2019·3 cites·19 claims
- 1082US9412891B2Thermal receiver for high power solar concentrators and method of assemblyIBM·Filed 2012·Granted Aug 9, 2016·2 cites·17 claims
- 1182US9324896B2Thermal receiver for high power solar concentrators and method of assemblyIBM·Filed 2013·Granted Apr 26, 2016·2 cites·17 claims
- 1280US9627784B1Method and apparatus for strain relieving surface mount attached connectorsIBM·Filed 2015·Granted Apr 18, 2017·2 cites·10 claims
- 1370US9275879B1Multi-chip module with rework capabilityIBM·Filed 2014·Granted Mar 1, 2016·2 cites·19 claims
- 1467US9714911B2Using in situ capacitance measurements to monitor the stability of interface materials in complex PCB assemblies and other structuresIBM·Filed 2013·Granted Jul 25, 2017·1 cites·9 claims
- 1566US10368441B2Method and apparatus for strain relieving surface mount attached connectorsIBM·Filed 2018·Granted Jul 30, 2019·1 cites·20 claims
- 1663US8129230B2Underfill method and chip packageGAYNES MICHAEL A·Filed 2009·Granted Mar 6, 2012·2 cites·13 claims
- 1760US10535618B2Tamper-proof electronic packages with stressed glass component substrate(s)IBM·Filed 2018·Granted Jan 14, 2020·0 cites·10 claims
- 1860US10535619B2Tamper-proof electronic packages with stressed glass component substrate(s)IBM·Filed 2018·Granted Jan 14, 2020·0 cites·12 claims
- 1959US9974179B2Method and apparatus for strain relieving surface mount attached connectorsIBM·Filed 2017·Granted May 15, 2018·0 cites·6 claims
- 2054US10750615B2Method and apparatus for strain relieving surface mount attached connectorsIBM·Filed 2019·Granted Aug 18, 2020·0 cites·20 claims
- 2154US9231139B2Structure and design of concentrator solar cell assembly receiver substrateGAYNES MICHAEL A·Filed 2011·Granted Jan 5, 2016·0 cites·22 claims
- 2251US2014377572A1Injection of a filler material with homogeneous distribution of anisotropic filler particles through implosionIBM·Filed 2013·Application pending·0 cites
- 2350US8492910B2Underfill method and chip packageGAYNES MICHAEL A·Filed 2012·Granted Jul 23, 2013·0 cites·4 claims
- 2447US9583410B2Volumetric integrated circuit and volumetric integrated circuit manufacturing methodIBM·Filed 2014·Granted Feb 28, 2017·0 cites·5 claims
- 2544US2009045501A1Structure on chip package to substantially match stiffness of chipIBM·Filed 2007·Application pending·0 cites
- 2637US2004150097A1Optimized conductive lid mounting for integrated circuit chip carriersIBM·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →