Inventor · disambiguated record
Michael Reyes Godoy
Also filed as: GODOY MICHAEL REYES
0 granted patents·3 pending applications·0 citations·filing 2021–2025
Technology areasH10W
Files withINFINEON TECHNOLOGIES AG3
Top patents by PatentIndex Score
3 records- 0160US2025391747A1Method of forming a die package and die package arrangementINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 0250US2024387305A1Semiconductor package having a die pad and an encapsulation with trenches and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0341US2022115245A1Power semiconductor package and method for fabricating a power semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →